EPF10K130EFC672-2X vs EPF10K200EFC672-2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K130EFC672-2X disebabkan oleh Intel dan EPF10K200EFC672-2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPF10K130EFC672-2X | EPF10K200EFC672-2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Series | FLEX 10KE | — |
| Number of Logic Elements (LEs) | 6656 | — |
| Number of Logic Array Blocks (LABs) | 832 | — |
| Total RAM Bits | 65536 | — |
| Number of User I/Os | 413 | — |
| Number of DLLs | 4 | — |
| Kemasan | 672-FBGA (FineLine BGA, 27x27 mm) | 672-BBGA (FineLine BGA) |
| Ball Pitch | 1.0 mm | 1.27 mm |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Supply Voltage | 3.3 V (MultiVolt I/O supports 5.0 V, 3.3 V, 2.5 V) | — |
| Suhu Operasi | 0C to +70C (commercial) | 0 C to 70 C |
| Process Technology | 0.22 μm CMOS SRAM | 0.22 um CMOS |
| Configuration Method | Serial configuration device, JTAG | — |
| Logic Family | CMOS, SRAM-based | CMOS |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (per distributor listing) |
| Family | — | FLEX 10KE |
| Logic Elements | — | 9,984 |
| Typical Gates | — | 200,000 |
| Maximum User I/Os | — | 470 |
| Embedded Memory | — | 98,304 bits |
| Embedded Array Blocks (EABs) | — | 12 |
| Logic Array Blocks (LABs) | — | 624 |
| Package Dimensions | — | 45 x 45 mm |
| Speed Grade | — | -2 |
| Propagation Delay | — | 0.4 ns |
| Supply Voltage (Core) | — | [DATA_NEEDED: core Vcc] |
| Programmability | — | JTAG (IEEE 1149.1) / in-system |