EPF10K200EBC600-3 vs EPF10K200EBI600-2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K200EBC600-3 disebabkan oleh Intel dan EPF10K200EBI600-2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 ObsoleteIntel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 ObsoletePengandingan Spesifikasi
| Parametr | EPF10K200EBC600-3 | EPF10K200EBI600-2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Series | FLEX-10KE | — |
| System Gates | 200,000 | 200,000 |
| Logic Elements / Cells | 9,984 | — |
| Logic Array Blocks (LABs) | 1248 | 1,248 |
| Embedded Memory (EABs) | 24,576 bits | — |
| Maximum User I/O | 470 | — |
| Number of PLLs | 4 | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| Process Technology | 0.22 micrometer SRAM | — |
| Speed Grade | -3 (commercial) | — |
| Kemasan | 600-ball FineLine BGA, 45 x 45 mm | BGA-600, 45 x 45 mm, 1.27 mm pitch |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Suhu Operasi | 0C to +70C (commercial) | 0 C to 70 C (commercial) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (lead-free package) |
| Logic Elements (LEs) | — | 9,984 |
| Embedded RAM | — | 98,304 bits |
| Embedded Array Blocks (EABs) | — | 12 (typical for this density) |
| User I/O Pins | — | 470 |
| Supply Voltage (VCCINT) | — | 2.5 V |
| Propagation Delay | — | 0.4 ns (per -2 speed grade) |
| Logic Family | — | CMOS, SRAM-based |
| Configuration Method | — | JTAG / ByteBlaster (SRAM configuration) |