EPF10K30EFC256-1X vs EPF10K100EFC256-2 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K30EFC256-1X disebabkan oleh Intel dan EPF10K100EFC256-2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EPF10K30EFC256-1X EPF10K100EFC256-2
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete NRND
Family FLEX 10KE —
Logic Elements 1728 —
Typical Gates 30,000 —
Logic Array Blocks (LABs) 216 —
Embedded Memory (EAB RAM) 24,576 bits (6 EABs of 4 Kbit each) —
User I/O 176 —
Maximum Internal Frequency 250 MHz —
Propagation Delay (tpd) 0.4 ns to 0.6 ns —
Process Technology 0.22 µm CMOS 0.22 µm CMOS SRAM
Core Supply Voltage 2.5 V —
MultiVolt I/O Support 2.5 V / 3.3 V / 5 V —
Kemasan 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch (FineLine BGA) 256-FBGA (FineLine BGA, 17 x 17 mm)
Speed Grade -1X (fastest commercial) —
Suhu Operasi 0 °C to +70 °C (commercial) 0 °C to +70 °C (Commercial)
Configuration Method SRAM, JTAG (IEEE 1149.1) PS, JTAG, in-system programmable
Phase-Locked Loops 4 —
Compliance RoHS (check distributor for specific lot), Pb-free option available —
Series — FLEX 10KE
Manufacturer — Intel (formerly Altera)
Logic Elements / Cells — 4,992 (49,152 user logic elements)
Number of LABs — 624
User I/Os — 191
Total RAM Bits — [DATA_NEEDED: total EAB RAM bits]
Number of Gates — 100,000 equivalent
Core Supply Voltage (VCCINT) — 2.375 V to 2.625 V
Logic Family — CMOS (SRAM-based)
Propagation Delay (per LUT) — ~0.6 ns (speed grade -2)
Jenis Pemasangan — Surface Mount (BGA)
Status RoHS — [DATA_NEEDED: RoHS compliance]
Embedded Array Blocks — Yes (EAB for RAM/ROM/DSP)

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