EPF10K30ETC144-3N vs EPF10K30ATC144-3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K30ETC144-3N disebabkan oleh Intel dan EPF10K30ATC144-3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPF10K30ETC144-3N | EPF10K30ATC144-3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | FLEX 10KE | FLEX 10KA (Embedded Programmable Logic Device) |
| Logic Family | CMOS | — |
| Typical Gates | 30,000 | — |
| Logic Elements / Cells | 1,728 | — |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded Memory Bits | 24,576 | — |
| User I/Os | 102 | — |
| Bilangan Pin | 144 | — |
| Package Type | TQFP-144 (22 × 22 mm, 0.5 mm pitch) | — |
| Package Code | LFQFP | — |
| Terminal Form | Gull Wing | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Technology | 0.22 µm CMOS, SRAM-based | — |
| Core Supply Voltage (VCCINT) | 2.5 V | — |
| Suhu Operasi | 0 °C to 70 °C (Commercial) | 0 C to 70 C (Commercial) |
| Propagation Delay | 0.6 ns (typical) | 0.6 ns (typical) |
| Internal Frequency | [DATA_NEEDED: internal frequency max] | — |
| Programming Method | JTAG (IEEE 1149.1), in-system SRAM configuration | — |
| Configuration Memory | Volatile SRAM (requires external configuration device) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Series | — | FLEX 10KA |
| Typical Gate Count | — | 30,000 gates |
| Logic Elements | — | 1,728 cells |
| Embedded Memory (RAM bits) | — | 12,288 bits |
| User I/O Pins | — | 102 |
| Kemasan | — | 144-LQFP / TQFP-144 |
| Process Technology | — | CMOS |
| Core Supply Voltage | — | 3.3 V |
| Internal Frequency (max) | — | 80 MHz |
| Speed Grade | — | -3 |
| Configuration | — | SRAM-based, in-circuit reconfigurable |