EPF10K30ETC144-3N vs EPF10K50ETC144-3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K30ETC144-3N disebabkan oleh Intel dan EPF10K50ETC144-3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPF10K30ETC144-3N | EPF10K50ETC144-3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Family | CMOS | CMOS |
| Typical Gates | 30,000 | — |
| Logic Elements / Cells | 1,728 | 2,880 |
| Logic Array Blocks (LABs) | 216 | 360 |
| Embedded Memory Bits | 24,576 | — |
| User I/Os | 102 | — |
| Bilangan Pin | 144 | 144 |
| Package Type | TQFP-144 (22 × 22 mm, 0.5 mm pitch) | TQFP-144 (also referred to as 144-LQFP) |
| Package Code | LFQFP | — |
| Terminal Form | Gull Wing | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Technology | 0.22 µm CMOS, SRAM-based | — |
| Core Supply Voltage (VCCINT) | 2.5 V | — |
| Suhu Operasi | 0 °C to 70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| Propagation Delay | 0.6 ns (typical) | 0.6 ns |
| Internal Frequency | [DATA_NEEDED: internal frequency max] | — |
| Programming Method | JTAG (IEEE 1149.1), in-system SRAM configuration | — |
| Configuration Memory | Volatile SRAM (requires external configuration device) | SRAM (volatile) |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs status] |
| Typical Gate Count | — | 50,000 gates |
| Total Memory Bits | — | 40,960 bits |
| User I/O Pins (this package) | — | 102 |
| Max User I/O (family) | — | 274 pins |
| Maximum Internal Frequency | — | 166.67 MHz |
| Internal Frequency (per DigChip summary) | — | 66.67 MHz |
| Process Technology | — | 0.22 µm CMOS |
| Core Supply Voltage | — | 2.5 V |
| JTAG Support | — | IEEE 1149.1 boundary scan |