EPM1270F256C5 vs EPM2210F256C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM1270F256C5 disebabkan oleh Altera dan EPM2210F256C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM1270F256C5 | EPM2210F256C4N |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX II | — |
| Family | EPM1270 | MAX II |
| Macro Cells | 980 | 1700 |
| Logic Array Blocks (LABs) | 16 | — |
| Maximum User I/O Pins | 212 | 212 (varies with package) |
| Pin-to-Pin Logic Delay (tPD) | 6.2 ns (C5 speed grade) | — |
| Internal Operating Frequency | 201.1 MHz | — |
| Core Supply Voltage | 2.5 V / 3.3 V | 3.0 V to 3.6 V (3.3 V typical) |
| I/O Standards Supported | LVCMOS/LVTTL 1.8 V, 2.5 V, 3.3 V, 5.0 V (MultiVolt) | — |
| Process Technology | 0.18 µm | 0.18 µm |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| User Flash Memory | 8 Kbits | 204 Kbit |
| Programming Interface | JTAG (IEEE 1149.1) / ISP via ByteBlaster / USB-Blaster | JTAG IEEE Std. 1149.1 + ISP |
| Kemasan | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA) |
| Suhu Operasi | 0 °C to +85 °C (commercial, 'C' grade) | — |
| Status RoHS | Compliant | Compliant |
| Device Type | — | CPLD |
| Logic Elements (LE) | — | 2210 |
| Maximum Internal Frequency | — | 247.5 MHz |
| Pin-to-Pin Propagation Delay (tPD) | — | 7.0 ns |
| Global Clock Networks | — | 4 |
| MultiVolt I/O Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz |
| Gambaran Suhu Operasi | — | 0 °C to +85 °C (Commercial) |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Lead-Free | — | Yes |