EPM2210F256C4N vs EPM1270F256C5 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM2210F256C4N disebabkan oleh Intel dan EPM1270F256C5 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM2210F256C4N | EPM1270F256C5 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | EPM1270 |
| Device Type | CPLD | — |
| Logic Elements (LE) | 2210 | — |
| Macro Cells | 1700 | 980 |
| User Flash Memory | 204 Kbit | 8 Kbits |
| Maximum Internal Frequency | 247.5 MHz | — |
| Pin-to-Pin Propagation Delay (tPD) | 7.0 ns | — |
| Maximum User I/O Pins | 212 (varies with package) | 212 |
| Global Clock Networks | 4 | — |
| Process Technology | 0.18 µm | 0.18 µm |
| Core Supply Voltage | 3.0 V to 3.6 V (3.3 V typical) | 2.5 V / 3.3 V |
| MultiVolt I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz | — |
| Gambaran Suhu Operasi | 0 °C to +85 °C (Commercial) | — |
| Kemasan | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (FBGA-256) |
| Programming Interface | JTAG IEEE Std. 1149.1 + ISP | JTAG (IEEE 1149.1) / ISP via ByteBlaster / USB-Blaster |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | MAX II |
| Logic Array Blocks (LABs) | — | 16 |
| Pin-to-Pin Logic Delay (tPD) | — | 6.2 ns (C5 speed grade) |
| Internal Operating Frequency | — | 201.1 MHz |
| I/O Standards Supported | — | LVCMOS/LVTTL 1.8 V, 2.5 V, 3.3 V, 5.0 V (MultiVolt) |
| Configuration Memory | — | On-chip flash (non-volatile, instant-on) |
| Suhu Operasi | — | 0 °C to +85 °C (commercial, 'C' grade) |