EPM240F100C5N vs EPM240GF100I5N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM240F100C5N disebabkan oleh Intel dan EPM240GF100I5N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM240F100C5N | EPM240GF100I5N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Family | MAX II | — |
| Logic Elements (LEs) | 240 | — |
| Macrocells | 192 | — |
| User I/O Pins (maximum) | 80 | — |
| Pin-to-Pin Logic Delay (tPD) | 4.7 ns | — |
| Maximum Operating Frequency | [DATA_NEEDED: fmax per datasheet] | — |
| Global Clock Networks | [DATA_NEEDED: count] | — |
| Kemasan | 100-ball FineLine BGA (FBGA-100) | 100-ball FBGA (FineLine BGA), 11 mm x 11 mm, 1.0 mm pitch |
| Gambaran Suhu Operasi | 0C to +85C (commercial) | — |
| Supply Voltage Core (VCCINT) | 3.3 V | — |
| I/O Bank Voltage (VCCIO) | 1.5V / 1.8V / 2.5V / 3.3V (MultiVolt) | — |
| Configuration Memory | Non-volatile flash (instant-on) | — |
| JTAG Support | IEEE 1149.1 boundary-scan | IEEE 1149.1 / IEEE 1532 compliant |
| Programming Interface | JTAG / ByteBlasterMV | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | — |
| Series | — | MAX II |
| Logic Elements / Blocks | — | 240 LE |
| Number of Macrocells | — | 192 |
| Maximum User I/O | — | 80 |
| Propagation Delay (tpd, max) | — | 4.7 ns |
| Programmable Type | — | In-System Programmable (ISP) |
| Non-Volatile Memory | — | On-chip flash configuration |
| Internal Supply Voltage | — | 1.71 V to 1.89 V (regulated on-chip) |
| I/O Supply Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Operating Temperature (TJ) | — | -40 C to +100 C |
| Lead-Free / RoHS | — | Yes (lead-free, RoHS compliant) |
| Logic Family | — | CMOS |
| Vertical Migration Family | — | EPM240 / EPM570 / EPM1270 / EPM2210 in same-package footprint |