EPM570F256C3 vs EPM570GF256C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570F256C3 disebabkan oleh Intel dan EPM570GF256C3 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM570F256C3 | EPM570GF256C3 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements / Macro Cells | 440 Logic Elements (~570 macro cells equivalent) | — |
| Maximum Operating Frequency | 304 MHz | — |
| Propagation Delay (tPD) | [DATA_NEEDED: tPD in ns] | — |
| User I/O Count | 80 (max for F256 package) | — |
| User Flash Memory | 8 Kbits | — |
| Supply Voltage - Core | 2.5 V / 3.3 V (MultiVolt core) | — |
| Supply Voltage - I/O | 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | — |
| Process Technology | 0.18 µm | 0.18 um 6-layer-metal flash |
| Kemasan | 256-FBGA (FineLine BGA) 17 × 17 mm | FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free |
| Jenis Pemasangan | Surface Mount | — |
| Programming Interface | JTAG (IEEE 1149.1) - ISP | JTAG (IEEE 1149.1) / ISP |
| Configuration Memory | Non-volatile on-chip flash | — |
| Suhu Operasi | Commercial: 0 °C to +85 °C (C3 grade) | — |
| Status RoHS | Compliant | Compliant (lead-free) |
| Lead-Free | Yes | — |
| Design Software | Quartus II / Quartus Prime (legacy support) | — |
| Device Model | — | EPM570 |
| Logic Elements (LE) | — | 570 |
| Equivalent Macrocells | — | 440 |
| User I/Os (max, FBGA-256) | — | 212 |
| User Flash Memory (UFM) | — | 8 Kbit |
| Propagation Delay tPD1 | — | 8.7 ns (C3 speed grade) |
| Internal Performance fMAX | — | 300 MHz |
| Supply Voltage VCCINT | — | 1.8 V (core, MultiVolt) |
| I/O Bank Voltage VCCIO | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Operating Temperature (commercial) | — | -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C) |
| Aras MSL | — | 3 (per JEDEC J-STD-020, typical for FBGA) |
| Vertical Migration Within FBGA-256 | — | Supported across EPM570 / EPM1270 / EPM2210 |