EPM570GF256C3 vs EPM570GF256C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570GF256C3 disebabkan oleh Altera dan EPM570GF256C3N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM570GF256C3 | EPM570GF256C3N |
|---|---|---|
| Merek | Altera | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II G |
| Device Model | EPM570 | — |
| Logic Elements (LE) | 570 | — |
| Equivalent Macrocells | 440 | — |
| User I/Os (max, FBGA-256) | 212 | — |
| User Flash Memory (UFM) | 8 Kbit | — |
| Propagation Delay tPD1 | 8.7 ns (C3 speed grade) | — |
| Internal Performance fMAX | 300 MHz | — |
| Process Technology | 0.18 um 6-layer-metal flash | — |
| Supply Voltage VCCINT | 1.8 V (core, MultiVolt) | 3.3 V (core) |
| I/O Bank Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Kemasan | FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free | 256-ball FineLine BGA (GF256), 17 x 17 mm, 1.0 mm pitch |
| Operating Temperature (commercial) | -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C) | — |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1) / in-system programmable |
| Status RoHS | Compliant (lead-free) | Lead Free / RoHS Compliant |
| Aras MSL | 3 (per JEDEC J-STD-020, typical for FBGA) | — |
| Vertical Migration Within FBGA-256 | Supported across EPM570 / EPM1270 / EPM2210 | — |
| Device Type | — | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LEs) | — | 570 |
| User I/Os | — | 76 |
| User Flash Memory | — | 8 Kbit |
| Logic Family | — | CMOS |
| I/O Bank Voltage | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Suhu Operasi | — | -40C to +125C (industrial) |
| Configuration Memory | — | On-chip Flash (non-volatile, instant-on) |
| Lead Free | — | Yes |