EPM570T144C4N vs EPM570T144C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570T144C4N disebabkan oleh Intel dan EPM570T144C3N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM570T144C4N | EPM570T144C3N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II |
| Logic Elements (LE) | 570 | — |
| Equivalent Macrocells | 440 | — |
| Maximum User I/O Pins | 212 (package-dependent; TQFP-144 user count varies) | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Process Technology | 0.18 µm flash CMOS, 6-layer metal | — |
| Maximum Internal Frequency (fMAX) | 247.5 MHz | — |
| Pin-to-Pin Propagation Delay (tPD) | 5.4 ns (C4 speed grade) | — |
| Core Supply Voltage (VCCINT) | 2.5 V / 3.3 V (MultiVolt core) | — |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | — |
| Programming Interface | JTAG (IEEE 1149.1) with in-system programmability (ISP) | JTAG (IEEE 1149.1), ISP |
| Suhu Operasi | -40 °C to +85 °C (industrial, suffix N) | 0C to +85C (commercial) |
| Kemasan | TQFP-144 (22 × 22 mm, 0.5 mm pitch) | TQFP-144 |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Aras MSL | 3 (per JEDEC J-STD-020) | — |
| Lead-Free / RoHS | Lead-free, RoHS compliant | — |
| Global Clock Networks | 4 | — |
| Non-Volatile Configuration | Yes (instant-on, no external boot PROM required) | — |
| Device | — | EPM570 |
| Logic Elements | — | 570 |
| Typical Macrocells | — | 440 |
| User I/Os | — | 116 |
| Propagation Delay (tPD) | — | 5.4 ns (max) |
| Maximum Frequency (fMAX) | — | 300 MHz (typ) |
| Core Voltage | — | 3.3 V |
| Process | — | 0.18 µm, 6-layer-metal flash CMOS |
| Status RoHS | — | Compliant |