H5AN8G6NAFR-VKC vs H5AN8G6NAFR-RDC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci H5AN8G6NAFR-VKC disebabkan oleh SK hynix dan H5AN8G6NAFR-RDC disebabkan oleh SK hynix. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | H5AN8G6NAFR-VKC | H5AN8G6NAFR-RDC |
|---|---|---|
| Merek | SK hynix | SK hynix |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | — |
| Organisasi | 512M x 16 | 512M x 16 |
| Core Supply Voltage | 1.2 V | — |
| Technology | CMOS | CMOS |
| Kemasan | FBGA-96 (PBGA96) | — |
| Speed Grade | -VKC (DDR4-2666 class, per SK Hynix part numbering) | -RDC (see datasheet for bin timing) |
| Data Rate Class | Up to 2666 MT/s (per -VKC speed code) | — |
| Family | H5AN8G4NAFR / H5AN8G8NAFR / H5AN8G6NAFR | H5AN8G4NAFR-xxC / H5AN8G8NAFR-xxC / H5AN8G6NAFR-xxC |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Lead-Free & Halogen-Free, RoHS Compliant | Compliant (Lead-Free & Halogen-Free) |
| Application | Main memory (high density, high bandwidth) | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Refresh | [DATA_NEEDED: refresh mode specification] | — |
| Latensi CAS | [DATA_NEEDED: CAS latency for -VKC bin] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Memory Density | — | 8 Gb |
| Tegangan Pemberi Arus | — | 1.2 V |
| Antaramuka | — | DDR4 (JEDEC-standard) |
| Access Mode | — | Multi Bank Page Burst |
| Package Code | — | TFBGA |
| Package Shape | — | Rectangular |
| Number of Terminals | — | 96 |
| Temperature Grade | — | OTHER (per Partstack listing) |
| Max Clock Rate | — | [DATA_NEEDED: max clock rate for -RDC bin] |