K3KL7L70EM-MGCU vs K3LK8L80CM-MGCT Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K3KL7L70EM-MGCU disebabkan oleh Samsung Electronics dan K3LK8L80CM-MGCT disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Samsung Electronics
K3KL7L70EM-MGCU - 12Gb LPDDR5X DRAM, 315-Ball FBGA | Samsung
K3KL7L70EM-MGCU ✓ AktifSamsung Electronics
K3LK8L80CM-MGCT - LPDDR5X 32Gbit DRAM FBGA-315 | Samsung
K3LK8L80CM-MGCT ✓ AktifPengandingan Spesifikasi
| Parametr | K3KL7L70EM-MGCU | K3LK8L80CM-MGCT |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | Samsung Electronics | — |
| Jenis Ingatan | LPDDR5X SDRAM | LPDDR5X SDRAM |
| Density | 12 Gbit (1.5 GB) | 32 Gbit (4 GB) |
| Kemasan | 315-ball FBGA | FBGA-315 (315-ball) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Speed Grade Suffix | -MGCU | CM-MGCT |
| Kadar Data | [DATA_NEEDED: data rate Mbps/pin] | — |
| Supply Voltage VDD | [DATA_NEEDED: VDD core voltage] | — |
| Supply Voltage VDDQ | [DATA_NEEDED: VDDQ I/O voltage] | — |
| Organisasi | [DATA_NEEDED: organization x32] | x32 |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | -25C to +85C |
| Bank Architecture | [DATA_NEEDED: bank group count] | — |
| Latensi CAS | [DATA_NEEDED: CAS latency] | — |
| Refresh | Self-refresh and per-bank refresh per JEDEC LPDDR5X | — |
| Termination | On-Die Termination (ODT) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant (per JLCPCB listing) |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL level] |
| Max Data Rate | — | 7500 Mbps |
| Supply Voltages | — | 0.5 V, 900 mV, 1.05 V, 1.8 V (multi-rail) |
| Antaramuka | — | LPDDR5X (JEDEC low-power DDR) |
| Power Efficiency | — | ~25% improvement vs LPDDR5 |
| Application Class | — | Mobile, PC, automotive, on-device AI |
| Package Family | — | FBGA -> BGA -> surface mount |
| Typical End Products | — | Smartphones, tablets, edge AI devices |
| Refresh / Standby Modes | — | Self-refresh, deep power-down (per LPDDR5X protocol) |