K4A4G085WD-BCTD vs K4A4G085WD-BCPB Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4A4G085WD-BCTD disebabkan oleh Samsung Electronics dan K4A4G085WD-BCPB disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Samsung Electronics
K4A4G085WD-BCTD - 4Gb DDR4 SDRAM 512Mx8 2666Mbps | Samsung
K4A4G085WD-BCTD ✓ AktifPengandingan Spesifikasi
| Parametr | K4A4G085WD-BCTD | K4A4G085WD-BCPB |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR4 SDRAM | DDR4 SDRAM |
| Die Generation | D-die | D-die |
| Density | 4 Gb | 4 Gb |
| Organisasi | 512M x 8 | 512M x 8 |
| Kadar Data | 2666 Mbps/pin | — |
| Tegangan Pemberi Arus | 1.2 V | 1.2 V |
| Suhu Operasi | 0C to +85C | [DATA_NEEDED: operating temperature range] |
| Kemasan | 78-ball FBGA | FBGA-78 (PB) |
| Ball Pitch | 0.8 mm | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Antaramuka | DDR4 (JEDEC-compatible) | DDR4 (Double Data Rate 4) |
| Speed Class | DDR4-2666 (PC4-21300) | — |
| Bank Architecture | DDR4 bank-group architecture | — |
| On-Die Termination (ODT) | Yes | — |
| DLL | Yes | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (PB lead-free suffix) |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Speed Grade / Data Rate | — | [DATA_NEEDED: speed grade / data rate] |
| Latensi CAS | — | [DATA_NEEDED: CAS latency] |
| Refresh | — | [DATA_NEEDED: refresh specification] |
| Boson Bebas | — | [DATA_NEEDED: halogen-free status] |
| Datasheet Pages | — | 66 pages (K4A4G085WD family datasheet) |