K4AAG085WA-BCPB vs K4AAG085WM-BCWE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4AAG085WA-BCPB disebabkan oleh Samsung Electronics dan K4AAG085WM-BCWE disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | K4AAG085WA-BCPB | K4AAG085WM-BCWE |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | DRAM |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit | 16 Gb |
| Organisasi | 2G x 8 | 2G x 8 |
| Tegangan Pemberi Arus | 1.2 V | 1.2 V |
| Speed Grade | [DATA_NEEDED: speed grade Mbps for BCPB suffix] | — |
| Kemasan | 78FBGA | 78FBGA |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | 0 C to 85 C (commercial grade, per K4AAG085WA family data) | 0C to +85C |
| Antaramuka | Parallel (DDR4) | DDR4 (JEDEC-standard) |
| Clock Type | Synchronous, differential clock | — |
| Bank Architecture | DDR4 bank group architecture | — |
| DLL Mode | DLL Enabled mode operation (per Samsung datasheet abstract) | — |
| Memory Format | DRAM | — |
| Status RoHS | Compliant (per family listing on JLCPCB) | [DATA_NEEDED: RoHS status] |
| Temperature Grade Code | C (per Samsung part number coding) | — |
| Speed Bin Code | PB (per Samsung part number coding) | — |
| Kadar Data | — | 3200 Mbps (DDR4-3200) |
| Bank Group Architecture | — | Yes (DDR4) |
| Speed Grade Suffix | — | -BCWE |
| Application Class | — | Memory IC / Storage Component |
| Power Reduction vs DDR3 | — | Approx. 25% lower (per Samsung DDR4 literature) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |