K4AAG085WA-BCRC vs K4AAG085WM-BCWE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4AAG085WA-BCRC disebabkan oleh Samsung Electronics dan K4AAG085WM-BCWE disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | K4AAG085WA-BCRC | K4AAG085WM-BCWE |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | DRAM | DRAM |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit | 16 Gb |
| Organisasi | 2G x 8 | 2G x 8 |
| Tegangan Pemberi Arus | 1.2 V | 1.2 V |
| Antaramuka | Parallel, DDR4 | DDR4 (JEDEC-standard) |
| Kemasan | 78FBGA (78-ball Fine-Pitch Ball Grid Array) | 78FBGA |
| Suhu Operasi | 0C to +85C | 0C to +85C |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Data Width | 8 bit | — |
| Generation | DDR4 | — |
| Speed Grade Suffix | BCRC | -BCWE |
| Maximum Data Rate | [DATA_NEEDED: maximum data rate (Mbps) for BCRC speed grade] | — |
| Latensi CAS | [DATA_NEEDED: CAS latency for BCRC speed grade] | — |
| On-Die Termination | Yes (DDR4 ODT) | — |
| Refresh | Self-refresh and auto-refresh (DDR4 standard) | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Family | K4AAG085WA (16Gb 2Gx8 DDR4 family) | — |
| Kadar Data | — | 3200 Mbps (DDR4-3200) |
| Bank Group Architecture | — | Yes (DDR4) |
| Application Class | — | Memory IC / Storage Component |
| Power Reduction vs DDR3 | — | Approx. 25% lower (per Samsung DDR4 literature) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |