M1AFS600-2FG484I vs AFS600-2FGG484 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci M1AFS600-2FG484I disebabkan oleh Microchip Technology dan AFS600-2FGG484 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Microchip Technology
M1AFS600-2FG484I M1AFS600-2FG484I - Fusion FPGA 600K Gates, 172 I/O | Microchip

M1AFS600-2FG484I - Fusion FPGA 600K Gates, 172 I/O | Microchip

M1AFS600-2FG484I ✓ Aktif
Microchip Technology
AFS600-2FGG484 AFS600-2FGG484 - 600K Gate Mixed-Signal FPGA | Microchip

AFS600-2FGG484 - 600K Gate Mixed-Signal FPGA | Microchip

AFS600-2FGG484 ✓ Aktif

Pengandingan Spesifikasi

Parametr M1AFS600-2FG484I AFS600-2FGG484
Merek Microchip Technology Microchip Technology
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Manufacturer Part Number M1AFS600-2FG484I —
Family Fusion (Flash FPGA with ARM Cortex-M1) —
System Gates 600K 600,000 gates
Logic Cells 13824 —
Total RAM Bits 110592 bits —
User I/O 172 —
Supply Voltage - Core 1.5 V (1.425 V to 1.575 V) —
Process Technology 130 nm CMOS 130 nm CMOS
Speed Grade 2 —
Reference Frequency (per distributor listing) 1470.59 MHz —
Kemasan 484-FBGA, 23x23 mm —
Jenis Pemasangan Surface Mount Surface mount
Suhu Operasi -40C to +100C (Industrial) 0 °C to +85 °C
Configuration Technology Flash (non-volatile, instant-on) —
Packaging Tray —
Status RoHS [DATA_NEEDED: RoHS status] —
Aras MSL [DATA_NEEDED: moisture sensitivity level] —
Device Type — Fusion mixed-signal field-programmable gate array (FPGA)
Logic Elements — 110,592 logic elements
User I/O Count — 172 I/O
Maximum Frequency — 1470.59 MHz
Tegangan Pemberi Arus — 1.5 V
Metal Layers — 7 layers
Package Type — 484-pin FBGA
Package Body Size — 23 x 23 mm
Package Pitch — 1.0 mm
Programmable Logic — Flash-based programmable logic
Analog Capability — Configurable embedded analog blocks
Clock Management — Comprehensive clock generation and management circuitry
Configuration Memory — Large embedded flash-memory blocks
Packaging Type — Tray
RoHS Compliance — [DATA_NEEDED: RoHS compliance]
REACH Compliance — [DATA_NEEDED: REACH compliance]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

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