M7AFS600-1FG256 vs M7AFS600-FG256 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M7AFS600-1FG256 disebabkan oleh Microchip Technology dan M7AFS600-FG256 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
M7AFS600-1FG256 - Fusion FPGA 600K Gates 256-FBGA | Microchip
M7AFS600-1FG256 ✓ AktifMicrochip Technology
M7AFS600-FG256 - Fusion FPGA 600K Gates, 119 I/O | Microchip
M7AFS600-FG256 ✓ AktifPengandingan Spesifikasi
| Parametr | M7AFS600-1FG256 | M7AFS600-FG256 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Logic Family | Microsemi Fusion (M7AFS600) | — |
| System Gates | 600K | 600000 gates |
| Embedded Processor Core | ARM CoreMP7 (32-bit) | — |
| Embedded Flash Configuration Memory | 110592 bits | — |
| Number of User I/O | 119 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Core Supply Voltage Range | 1.425 V to 1.575 V | — |
| Process Technology | 130 nm flash-based | 130 nm Flash |
| Configuration Type | Non-volatile Flash, single-chip, instant-on | Flash-based, non-volatile |
| Maximum Frequency | 1282.05 MHz (per distributor listing) | — |
| Kemasan | 256-ball FBGA/LBGA (FG256) | — |
| Jenis Pemasangan | Surface Mount | — |
| Suhu Operasi | -40C to +85C | 0 C to +70 C (commercial) |
| Packaging | Tray | Tray |
| Speed Grade | -1 (standard) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Total Package Balls | 256 | — |
| Series | — | M7AFS600 (Fusion) |
| D Flip-Flops / Registers | — | 110592 |
| User I/O | — | 119 |
| Embedded Processor | — | ARM CoreMP7 |
| Maximum Operating Frequency | — | 1098.9 MHz (per FPGAkey listing) |
| Kemasan / Case | — | 256-LBGA (FBGA), 17x17x1.7 mm |
| Terminal Form | — | Ball (SMD/SMT) |
| Gaya Pemasangan | — | Surface Mount |
| Product Type | — | Mixed-Signal FPGA |