M7AFS600-1FG256 vs M7AFS600-FG256 比較

詳細並排比較 M7AFS600-1FG256 由 Microchip Technology 與 M7AFS600-FG256 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
M7AFS600-1FG256 M7AFS600-1FG256 - Fusion FPGA 600K Gates 256-FBGA | Microchip

M7AFS600-1FG256 - Fusion FPGA 600K Gates 256-FBGA | Microchip

M7AFS600-1FG256 ✓ 啟用中
Microchip Technology
M7AFS600-FG256 M7AFS600-FG256 - Fusion FPGA 600K Gates, 119 I/O | Microchip

M7AFS600-FG256 - Fusion FPGA 600K Gates, 119 I/O | Microchip

M7AFS600-FG256 ✓ 啟用中

規格比較

參數 M7AFS600-1FG256 M7AFS600-FG256
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Logic Family Microsemi Fusion (M7AFS600) —
System Gates 600K 600000 gates
Embedded Processor Core ARM CoreMP7 (32-bit) —
Embedded Flash Configuration Memory 110592 bits —
Number of User I/O 119 —
Core Supply Voltage 1.5 V 1.5 V
Core Supply Voltage Range 1.425 V to 1.575 V —
Process Technology 130 nm flash-based 130 nm Flash
Configuration Type Non-volatile Flash, single-chip, instant-on Flash-based, non-volatile
Maximum Frequency 1282.05 MHz (per distributor listing) —
封裝 256-ball FBGA/LBGA (FG256) —
安裝類型 Surface Mount —
工作溫度 -40C to +85C 0 C to +70 C (commercial)
Packaging Tray Tray
Speed Grade -1 (standard) —
RoHS 狀態 [DATA_NEEDED: RoHS status] Compliant
Total Package Balls 256 —
Series — M7AFS600 (Fusion)
D Flip-Flops / Registers — 110592
User I/O — 119
Embedded Processor — ARM CoreMP7
Maximum Operating Frequency — 1098.9 MHz (per FPGAkey listing)
封裝 / 外殼 — 256-LBGA (FBGA), 17x17x1.7 mm
Terminal Form — Ball (SMD/SMT)
安裝方式 — Surface Mount
Product Type — Mixed-Signal FPGA

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