M7AFS600-1FG484I vs M7AFS600-2FG484I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M7AFS600-1FG484I disebabkan oleh Microchip Technology dan M7AFS600-2FG484I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip
M7AFS600-1FG484I ✓ AktifMicrochip Technology
M7AFS600-2FG484I - 600K Gate Flash FPGA, 172 I/O | Microchip
M7AFS600-2FG484I ✓ AktifPengandingan Spesifikasi
| Parametr | M7AFS600-1FG484I | M7AFS600-2FG484I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| System Gates | 600000 | 600000 gates |
| Programmable Logic Tiles | 110592 | — |
| User I/O | 172 | 172 |
| Family | Fusion (Flash FPGA with optional ARM CoreMP7 support) | Fusion (Flash-Based FPGA) |
| Process Technology | 130 nm, 7-layer metal, Flash-based CMOS | 130 nm, 7-layer metal flash-based CMOS |
| Configuration Memory | Nonvolatile Flash, retains program when powered off | Nonvolatile on-chip flash (retains program when powered off) |
| Power-Up Feature | Live at Power-Up (LAPU) | — |
| Supply Voltage (Core) | 1.5 V | — |
| Logic Family | CMOS | CMOS |
| Speed Grade | 1 | -2 |
| Kemasan | 484-ball FBGA (FG484), 23 x 23 x 2.44 mm | 484-ball FBGA, 1.0 mm pitch |
| Ball Pitch | 1.0 mm | — |
| Suhu Operasi | Industrial, -40C to +85C | 0 to 70 C |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Embedded Processor Support | ARM CoreMP7 | — |
| Status RoHS | Compliant | — |
| Logic Elements (D Flip-Flops) | — | 110592 |
| Core Supply Voltage | — | 1.5 V |
| Live at Power-Up (LAPU) | — | Yes |
| Optional Processor Support | — | ARM CoreMP7 |
| Temperature Grade | — | Industrial (I suffix) |
| Packaging | — | Tray |