MC68HC16Z1CEH16 vs MC68HC16Z1CEH25 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC68HC16Z1CEH16 disebabkan oleh NXP Semiconductors dan MC68HC16Z1CEH25 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MC68HC16Z1CEH16 MC68HC16Z1CEH16 - 16MHz CPU16 MCU 1K RAM ROMless 132-PQFP | NXP

MC68HC16Z1CEH16 - 16MHz CPU16 MCU 1K RAM ROMless 132-PQFP | NXP

MC68HC16Z1CEH16 ✗ Akhir Hayat
NXP Semiconductors
MC68HC16Z1CEH25 MC68HC16Z1CEH25 - 16-Bit HC16 MCU 25MHz ROMless 132-PQFP | NXP

MC68HC16Z1CEH25 - 16-Bit HC16 MCU 25MHz ROMless 132-PQFP | NXP

MC68HC16Z1CEH25 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr MC68HC16Z1CEH16 MC68HC16Z1CEH25
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Akhir Hidup Masa Terakhir Dibeli
Core CPU16 (16-bit CISC) —
Series M68HC16Z1 —
Maximum CPU Clock 16 MHz —
Program Memory ROMless (external memory required) —
On-chip RAM 1 KB —
Lebar Bus Data 16-bit —
Operating Voltage 3.3 V / 5 V —
Kemasan 132-pin PQFP (24.13 x 24.13 mm) 132-Pin PQFP (24.13 x 24.13 mm)
Jenis Pemasangan Surface Mount Surface Mount
Automotive Qualification AEC-Q100 —
Code Compatibility Upwardly compatible with M68HC11 family Upward compatible with 68HC11 family
Internal Bus IMB (Intermodule Bus) —
Suhu Operasi [DATA_NEEDED: operating temperature range] -40C to +85C (industrial)
Status RoHS [DATA_NEEDED: RoHS compliance] —
Lead-Free [DATA_NEEDED: lead-free status] —
Core Processor — CPU16 (HC16)
Core Size — 16-Bit
Frekuensi Klock Maksimum — 25 MHz
Program Memory Type — ROMless (external memory required)
Program Memory Size — Not present (ROMless)
RAM Size — 1 KB (1K x 8)
EEPROM Size — Not present
Number of I/O Pins — 16
Connectivity — EBI/EMI, SCI, SPI
Peripherals — POR, PWM, WDT (Watchdog Timer)
Tegangan Pemberi Arus — 3.3 V / 5 V dual-rail
AEC-Q100 Qualification — Qualified (Automotive Grade)
Architecture — CISC with common Intermodule Bus (IMB)
Packaging Media — Tray

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