MC8640DTHX1067NE vs MC8640DTVJ1067NE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC8640DTHX1067NE disebabkan oleh NXP Semiconductors dan MC8640DTVJ1067NE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC8640DTHX1067NE - Dual-Core PowerPC e600 SoC, 2x1067MHz | NXP
MC8640DTHX1067NE ⚠ Bahagian terakhir untuk beliNXP Semiconductors
MC8640DTVJ1067NE - Dual-Core PowerPC SoC, 2x1067MHz | NXP
MC8640DTVJ1067NE ✗ Akhir HayatPengandingan Spesifikasi
| Parametr | MC8640DTHX1067NE | MC8640DTVJ1067NE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Akhir Hidup |
| Core Architecture | PowerPC e600 (dual-core) | PowerPC e600 (dual-core) |
| Number of Cores | 2 | — |
| Core Frequency | 1.067 GHz per core (2x1067 MHz) | 2 x 1067 MHz (1.067 GHz) |
| SIMD Engine | AltiVec | AltiVec |
| Data Width | 32-Bit | — |
| Core Voltage | 0.95 V | — |
| Memory Controller | DDR1/DDR2 with ECC | Dual-channel DDR1/DDR2 with ECC |
| Ethernet | Dual integrated GbE MACs | 2 x 10/100/1000 Mbps (GbE, SGMII) |
| PCI Express | Integrated multi-lane PCIe | 2 x PCIe Gen1 |
| Serial RapidIO | Integrated SRIO | 2 x SRIO |
| Die Revision | Rev 3.0 (G8 stepping) | — |
| Kemasan | 1023-ball FCBGA (33x33 mm) | 1023-ball FCCBGA, 33 x 33 mm |
| Suhu Operasi | -40C to +105C (Industrial) | -40C to +105C |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Product Type | — | 32-Bit Power Architecture SoC (Dual-Core MPU) |
| Silicon Revision | — | Rev 3 |
| Supply Voltages | — | 1.05V core / 1.8V DDR / 2.5V-3.3V I/O |
| Compliance / Status | — | End-of-Life per NXP PCN |