MC9S08AW48CPUE vs MC9S08AW16CPUE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08AW48CPUE disebabkan oleh NXP Semiconductors dan MC9S08AW16CPUE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MC9S08AW48CPUE | MC9S08AW16CPUE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Core Processor | S08 (HCS08) 8-bit CISC | S08 (HCS08) |
| Core Size | 8-bit | 8-Bit |
| CPU Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Program Memory Type | FLASH | FLASH |
| Program Memory Size | 48 KB (48K x 8) | 16KB (16K x 8) |
| RAM Size | [DATA_NEEDED: RAM size] | 1K x 8 |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Count | 38 | — |
| Package Type | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) | — |
| Package Height | 1 mm | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | -40C to +85C |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Instruction Set | HC08 with added BGND instruction | HC08 with added BGND instruction |
| Packaging | Tray | — |
| Status Lingkungan Hidup | NRND (Not Recommended for New Designs) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Core Architecture | — | CISC |
| Frekuensi Klock Maksimum | — | 40 MHz (CPU) / 20 MHz (bus) |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 16 |
| I/O Ports | — | 38 |
| Oscillator Type | — | Internal |
| Kemasan | — | 64-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 |