MC9S12B64MFUE vs MC9S12B128CFUE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12B64MFUE disebabkan oleh NXP Semiconductors dan MC9S12B128CFUE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MC9S12B64MFUE | MC9S12B128CFUE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | HCS12 | — |
| Core | HCS12 (CISC) | HCS12 (S12B) |
| Lebar Bus Data | 16-bit | 16 bit |
| Frekuensi Klock Maksimum | 25 MHz | 25 MHz |
| Program Memory Size (Flash) | 64 KB (64K x 8) | — |
| RAM Size | 2 KB | 8 KB |
| Tegangan Pemberi Arus | 5 V | — |
| Kemasan | 80-QFP (14 x 14 mm) | 80-LQFP (14x14 mm) |
| Kiraan Pin | 80 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Communication Interfaces | CAN, SCI (UART), SPI | — |
| A/D Channels | [DATA_NEEDED: A/D channel count] | — |
| A/D Resolution | [DATA_NEEDED: A/D resolution] | — |
| Timers | [DATA_NEEDED: timer module count] | — |
| PWM Channels | [DATA_NEEDED: PWM channel count] | 8 |
| Gambaran Suhu Operasi | [DATA_NEEDED: operating temperature range] | -40C to +85C |
| Debug Interface | BDM (Background Debug Mode) | BDM (Background Debug Mode) |
| Status RoHS | RoHS non-compliant (Pb-free process, SnPb or matte tin finish per datasheet packaging code) | Compliant |
| Lead-Free / Lead Content | [DATA_NEEDED: lead-free status] | — |
| Program Memory Size | — | 128 KB Flash |
| EEPROM Size | — | 4 KB |
| Supply Voltage Range | — | 5 V typical (4.5 V to 5.5 V) |
| ADC | — | 8-channel, 10-bit |
| CAN Module | — | MSCAN (CAN 2.0 A/B) |
| SCI / SPI | — | 3 x SCI, 2 x SPI |
| GPIO Count | — | 59 (maximum) |
| On-chip Oscillator | — | Yes (PLL with internal reference) |