MC9S12DJ256CPV vs MC9S12XEQ384CAG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12DJ256CPV disebabkan oleh NXP Semiconductors dan MC9S12XEQ384CAG disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC9S12DJ256CPV - 16-bit 256KB Flash HCS12 MCU | NXP 112-LQFP
MC9S12DJ256CPV ✓ Aktif
Pengandingan Spesifikasi
| Parametr | MC9S12DJ256CPV | MC9S12XEQ384CAG |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core | HCS12 CPU12 (16-bit CISC) | — |
| Maximum CPU Clock | 25 MHz | — |
| Program Memory (Flash) | 256 KB | — |
| Data Memory (RAM) | 12 KB | — |
| EEPROM | 4 KB | Hardware-emulated EEPROM (programmable, flexible) |
| Tegangan Pemberi Arus | 5 V | [DATA_NEEDED: Supply Voltage] |
| Suhu Operasi | -40C to +85C (industrial) | -40C to +85C (TA) |
| CAN Modules | 2 x CAN 2.0A/B | — |
| SCI Modules | 2 x SCI (UART) | — |
| SPI Modules | 2 x SPI | — |
| IIC Module | 1 x IIC (Inter-IC Bus) | — |
| ADC | 8-channel 10-bit | — |
| Enhanced Capture Timer | 8-channel (IC/OC/PWM) | — |
| GPIO | Up to 20 discrete digital I/O lines | — |
| Kemasan | 112-pin LQFP (20x20 mm) | 144-LQFP (20x20 mm) |
| Jenis Pemasangan | Surface Mount (Gull Wing) | Surface Mount |
| AEC-Q100 Qualification | Yes (automotive grade) | — |
| Background Debug Mode (BDM) | Yes | — |
| Core Processor | — | HCS12X (16-bit CISC) |
| Core Size | — | 16-bit |
| Bus Speed | — | 50 MHz |
| Co-processor | — | XGATE RISC co-processor |
| Flash Memory | — | 384 KB (384K x 8) |
| RAM Size | — | 24K x 8 |
| ADC Resolution | — | 12-bit |
| ADC Conversion Time | — | 3 us |
| Timers | — | Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real Time Interrupt (RTI) |
| Memory Protection | — | MPU with supervisor/user modes |
| I/O Ports | — | [DATA_NEEDED: I/O Ports count] |
| Packaging | — | Tray |
| Lifecycle Stage | — | Active |