MC9S12XA256CAL vs MC9S12H256VPVE Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12XA256CAL disebabkan oleh NXP Semiconductors dan MC9S12H256VPVE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MC9S12XA256CAL MC9S12XA256CAL - 16-bit 80MHz 256KB Flash MCU | NXP

MC9S12XA256CAL - 16-bit 80MHz 256KB Flash MCU | NXP

MC9S12XA256CAL Nrnd
NXP Semiconductors
MC9S12H256VPVE MC9S12H256VPVE - 16-bit 50MHz HCS12 MCU 256KB Flash LQFP-112 | NXP

MC9S12H256VPVE - 16-bit 50MHz HCS12 MCU 256KB Flash LQFP-112 | NXP

MC9S12H256VPVE ✓ Aktif

Pengandingan Spesifikasi

Parametr MC9S12XA256CAL MC9S12H256VPVE
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND Aktif
Core Processor HCS12X (S12XA), 16-bit CISC —
Core Size 16-bit —
Maximum Clock Speed 80 MHz —
Program Memory Size 256 KB (256K x 8) Flash —
RAM Size [DATA_NEEDED: exact RAM size] —
Supply Voltage Range 2.35 V to 5.5 V —
I/O Count 59 —
ADC Resolution 10 bit —
Lebar Bus Data 16 bit —
Kemasan 112-LQFP (20x20 mm) 112-LQFP (20 x 20 mm)
Jenis Pemasangan Surface Mount (SMD/SMT, gull-wing) Surface Mount
Temperature Grade [DATA_NEEDED: operating temperature range] —
Status Lingkungan Hidup NRND (Not Recommended for New Designs) per NXP —
Architecture Family S12X / HCS12X —
Program Memory Type FLASH —
Status RoHS [DATA_NEEDED: RoHS compliance detail] Compliant
Kiraan Pin 112 —
Core — HCS12 (16-bit)
Maximum CPU Frequency — 50 MHz
Program Flash Memory — 256 KB (256K x 8)
On-chip RAM — 12 KB
On-chip EEPROM — 4 KB
Operating Voltage — 4.5 V to 5.5 V (regulated internally to 2.5 V core)
Suhu Operasi — -40 °C to +105 °C
CAN Modules (msCAN) — 2 x CAN 2.0A/B
SCI (UART) Modules — 2
SPI Modules — 2
IIC (I²C) Modules — 1
A/D Converter — 10-bit, 8/16 channels
Enhanced Capture Timer — 16-bit, 8 channels
PWM Channels — 8 x 8-bit or 4 x 16-bit
General-Purpose I/O — Up to 91 pins
Debug Interface — Background Debug Mode (BDM)
Low-Power Modes — STOP, PSEIP pseudofrozen

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