MC9S12XDT512MAA vs MC9S12D64VFUE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12XDT512MAA disebabkan oleh NXP Semiconductors dan MC9S12D64VFUE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MC9S12XDT512MAA | MC9S12D64VFUE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core Processor | HCS12X | HCS12 |
| Core Size | 16-Bit | 16-bit |
| Maximum Clock Speed | 80 MHz | — |
| Program Memory Size | 512KB (512K x 8) | — |
| Program Memory Type | FLASH | FLASH |
| RAM Size | 20KB | [DATA_NEEDED: SRAM size] |
| EEPROM Size | 4KB | [DATA_NEEDED: EEPROM size] |
| Connectivity | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | [DATA_NEEDED: connectivity interfaces] |
| Peripherals | LVD, POR, PWM, WDT | [DATA_NEEDED: peripheral list (CAN, SCI, SPI, ADC, PWM)] |
| Number of I/O | 59 | — |
| ADC Resolution | 10-bit, 8-channel | — |
| Tegangan Pemberi Arus | [DATA_NEEDED: supply voltage range] | 2.5V / 5V |
| Suhu Operasi | -40C to +125C (TA) | [DATA_NEEDED: operating temperature range] |
| Kemasan | 80-QFP (14x14 mm), Square, Gull Wing | 80-QFP (14x14 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Packaging Method | Tray | — |
| Boson Bebas | Compliant | — |
| ECCN | 3A991.a.2 | — |
| Estimated EOL Date | 2028 | — |
| Core Architecture | — | 16-bit CISC |
| Frekuensi Klock Maksimum | — | 25 MHz |
| Flash Memory | — | 64KB (64K x 8) |
| Supplier Device Package | — | 80-QFP |
| Base Product Number | — | MC9S12D64 |
| Family Series | — | S12D (MC9S12D-Family) |
| Packaging | — | Tray |
| Application Target | — | Automotive multiplexing |