MCF5275CVM166 vs MCF5274CVM166 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MCF5275CVM166 disebabkan oleh NXP Semiconductors dan MCF5274CVM166 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MCF5275CVM166 - ColdFire V2 32-bit MPU, 166MHz, 256-MAPBGA | NXP
MCF5275CVM166 NrndPengandingan Spesifikasi
| Parametr | MCF5275CVM166 | MCF5274CVM166 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Core | ColdFire V2 (32-bit) | — |
| Frekuensi Klock Maksimum | 166 MHz | 166 MHz |
| On-Chip SRAM | 64 KB | — |
| Program Memory Size | ROMless | [DATA_NEEDED: program memory size] |
| Program Memory Type | External (ROMless) | ROMless |
| Kemasan | 256-MAPBGA (17x17 mm) | 256-map BGA, 17 mm x 17 mm |
| Number of I/O Lines | 69 | — |
| Connectivity | EBI/EMI, Ethernet, I2C, SPI (QSPI), UART/USART, USB | — |
| Ethernet | Dual 10/100 MAC | — |
| USB | USB 1.1 device/host | — |
| CAN | 2x CAN 2.0B | — |
| Peripherals | DMA, WDT, timers, hardware crypto (DES/3DES/AES/SHA) | — |
| Supply Voltage Core | 1.5 V | — |
| Supply Voltage I/O | 3.3 V | — |
| Suhu Operasi | -40C to +85C (industrial) | -40°C to 85°C |
| Jenis Pemasangan | Surface Mount (BGA) | Surface mount |
| Status RoHS | Compliant | — |
| Product Type | — | 32-bit ROMless integrated microprocessor |
| Processor Core | — | ColdFire V2 |
| Instruction Width | — | 32 bit |
| External Oscillator | — | External |
| Nominal I/O Supply Voltage | — | 2.5 V / 3.3 V |
| Core Supply Range in Cross-Reference Result | — | 1.4 V to 1.6 V |
| RAM Organization Reported by Third-Party Listing | — | 64K x 8 |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |
| Number of GPIO Pins | — | [DATA_NEEDED: GPIO pin count] |
| Ethernet Interface | — | [DATA_NEEDED: Ethernet interface configuration] |
| External Memory Interface | — | [DATA_NEEDED: external memory interface configuration] |
| RoHS Compliance | — | [DATA_NEEDED: RoHS compliance] |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |