MCF5307AI66B vs MCF5307FT66B Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MCF5307AI66B disebabkan oleh NXP Semiconductors dan MCF5307FT66B disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MCF5307AI66B MCF5307AI66B - ColdFire V3 32-bit 66MHz MCU | NXP

MCF5307AI66B - ColdFire V3 32-bit 66MHz MCU | NXP

MCF5307AI66B ✗ Akhir Hayat
NXP Semiconductors
MCF5307FT66B MCF5307FT66B - 66MHz ColdFire V3 MCU 208-FQFP | NXP

MCF5307FT66B - 66MHz ColdFire V3 MCU 208-FQFP | NXP

MCF5307FT66B Nrnd

Pengandingan Spesifikasi

Parametr MCF5307AI66B MCF5307FT66B
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Akhir Hidup NRND
Core Processor ColdFire V3 (MCF530x) —
Core Size 32-Bit —
Maximum Clock Speed 66 MHz —
Performance 70 MIPS —
Program Memory Type ROMless ROMless (external memory required)
RAM Size 4 KB SRAM —
Connectivity EBI/EMI, I2C, UART/USART —
Peripherals DMA, POR, WDT —
Number of I/O 16 —
DRAM Controller Yes (integrated) —
MAC Module Yes (multiply-accumulate) —
Kemasan 208-FQFP (28x28 mm) —
Jenis Pemasangan Surface Mount Surface Mount
Part Status End of Life / Not For New Designs —
Suhu Operasi [DATA_NEEDED: operating temperature range] [DATA_NEEDED: temperature grade per device marking]
Tegangan Pemberi Arus [DATA_NEEDED: supply voltage range] [DATA_NEEDED: VDD nominal - 3.3 V typical per family datasheet]
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: per device marking]
Core Architecture — ColdFire V3 (MCF530x)
Lebar Bus Data — 32-bit
Frekuensi Klock Maksimum — 66 MHz
On-chip SRAM — 4 KB (4K x 8)
Number of I/O Lines — 16
Oscillator Type — External
Kemasan / Case — 208-BFQFP (28x28 mm)
External Memory Controller — Yes (ROM/SRAM/DRAM/Flash)
DMA Channels — [DATA_NEEDED: DMA channel count]
Timers — [DATA_NEEDED: timer module count]
Serial Interfaces — [DATA_NEEDED: UART/SPI/I2C instance count]
Packaging (distributor) — Tray

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