MMA6262QR2-FR vs MMA6262QR2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MMA6262QR2-FR disebabkan oleh NXP Semiconductors dan MMA6262QR2 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MMA6262QR2-FR - ±1.5g Dual-Axis Micromachined Accelerometer | NXP
MMA6262QR2-FR NrndNXP Semiconductors
MMA6262QR2 - ±1.5g X/Y Dual-Axis Accelerometer | NXP
MMA6262QR2 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | MMA6262QR2-FR | MMA6262QR2 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Motion Sensors | Motion Sensors |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Jenis Sensus | Accelerometer, dual-axis (X, Y) | Accelerometer, Dual-Axis (X, Y) |
| Acceleration Range | ±1.5 g | ±1.5 g |
| Sensitivity | 800 mV/g (typical, ratiometric) | 740 mV/g to 860 mV/g (at 3.3 V) |
| Jenis Output | Analog, ratiometric to VDD | Analog, Ratiometric |
| Number of Axes | 2 (X, Y) | — |
| Bandwidth (-3 dB) | 150 Hz (internal 1-pole LPF) | — |
| Supply Voltage (VDD) | 2.2 V to 3.6 V | 3.15 V to 5.25 V (per MMA6801KW comp doc) |
| Arus Pemberi Arus | 2 mA (typical) | — |
| Zero-g Output (ratiometric) | VDD/2 (typical) | — |
| Suhu Operasi | -40 °C to +105 °C | -40 °C to +105 °C [DATA_NEEDED: confirm upper limit from full NXP datasheet] |
| Shock Survival | 2000 g | — |
| Self-Test | Yes (external logic input) | — |
| Kemasan | 16-QFN-EP, 6 mm x 6 mm, exposed thermal pad | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | RoHS Compliant (Contains Lead in some variants - check datasheet) | RoHS3 Compliant |
| MEMS Process | Capacitive micromachined (surface micromachining) | — |
| Bandwidth (Low-Pass Filter) | — | 150 Hz (1-pole factory-set) |
| Zero-g Offset | — | Factory calibrated, no external trim required |
| Temperature Compensation | — | On-chip, factory-set |
| Kemasan / Case | — | 16-QFN-EP (6x6 mm) |
| Supplier Device Package | — | 16-QFN-EP (6x6) |
| Lead Free Status | — | Contains Lead (per digchip snippet) |
| Sense Technology | — | Capacitive Micromachined (MEMS) |