MPC8555VTAPF vs MPC8560VT833LB Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8555VTAPF disebabkan oleh NXP Semiconductors dan MPC8560VT833LB disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC8555VTAPF - 833MHz PowerQUICC III MPU | NXP | 783-FCPBGA
MPC8555VTAPF ✗ Akhir HayatNXP Semiconductors
MPC8560VT833LB - 833MHz PowerQUICC III MPU | Freescale/NXP | BGA-783
MPC8560VT833LB ObsoletePengandingan Spesifikasi
| Parametr | MPC8555VTAPF | MPC8560VT833LB |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Obsolete |
| Core Processor | PowerPC e500 | PowerPC e500 |
| Number of Cores | 1 Core, 32-Bit | 1 |
| Maximum Core Frequency | 833 MHz | — |
| Co-Processor / DSP | Communications; CPM (Communications Processor Module) | — |
| Memory Controllers | DDR, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | Yes (per datasheet) | — |
| Ethernet | Dual 10/100/1000 MAC with TCP/IP acceleration | — |
| PCI / PCI-X Interfaces | Dual PCI/PCI-X | — |
| Security Engine | IPSec / SSL / TLS / 3DES / AES acceleration | — |
| Local Bus Controller | Yes | — |
| L1 Cache | 32 KB Instruction + 32 KB Data | — |
| Suhu Operasi | -40C to +105C (Industrial / Extended) | [DATA_NEEDED: operating temperature range] |
| Kemasan | 783-FCPBGA, 29x29 mm | 783-FCPBGA (29x29 mm) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Part Status | Not For New Designs | Obsolete / End of Life (per Rochester listing) |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Bus Width | — | 32-bit |
| Core Speed | — | 833 MHz |
| Series | — | MPC85xx |
| Product Family | — | PowerQUICC III |
| Instruction Set Architecture | — | RISC (PowerPC) |
| Tegangan Pemberi Arus | — | 2.5 V / 3.3 V |
| Packaging Format | — | Tray |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | [DATA_NEEDED: lead-free] |
| Peripheral Integration | — | QUICC Engine, memory controller, local bus, Ethernet, PCI/PCI-X |