MPC8555VTAPF vs MPC8560VT833LB 比較
詳細並排比較 MPC8555VTAPF 由 NXP Semiconductors 與 MPC8560VT833LB 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MPC8560VT833LB - 833MHz PowerQUICC III MPU | Freescale/NXP | BGA-783
MPC8560VT833LB Obsolete規格比較
| 參數 | MPC8555VTAPF | MPC8560VT833LB |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 停產終止 | Obsolete |
| Core Processor | PowerPC e500 | PowerPC e500 |
| Number of Cores | 1 Core, 32-Bit | 1 |
| Maximum Core Frequency | 833 MHz | — |
| Co-Processor / DSP | Communications; CPM (Communications Processor Module) | — |
| Memory Controllers | DDR, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | Yes (per datasheet) | — |
| Ethernet | Dual 10/100/1000 MAC with TCP/IP acceleration | — |
| PCI / PCI-X Interfaces | Dual PCI/PCI-X | — |
| Security Engine | IPSec / SSL / TLS / 3DES / AES acceleration | — |
| Local Bus Controller | Yes | — |
| L1 Cache | 32 KB Instruction + 32 KB Data | — |
| 工作溫度 | -40C to +105C (Industrial / Extended) | [DATA_NEEDED: operating temperature range] |
| 封裝 | 783-FCPBGA, 29x29 mm | 783-FCPBGA (29x29 mm) |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Part Status | Not For New Designs | Obsolete / End of Life (per Rochester listing) |
| RoHS 狀態 | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Bus Width | — | 32-bit |
| Core Speed | — | 833 MHz |
| Series | — | MPC85xx |
| Product Family | — | PowerQUICC III |
| Instruction Set Architecture | — | RISC (PowerPC) |
| 供應電壓 | — | 2.5 V / 3.3 V |
| Packaging Format | — | Tray |
| MSL 等級 | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | [DATA_NEEDED: lead-free] |
| Peripheral Integration | — | QUICC Engine, memory controller, local bus, Ethernet, PCI/PCI-X |