MPC8572VTAVNE vs MPC8572ECVTAVNE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8572VTAVNE disebabkan oleh NXP Semiconductors dan MPC8572ECVTAVNE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC8572VTAVNE - PowerPC e500 Dual-Core 1.5GHz SoC | NXP | FCBGA-1023
MPC8572VTAVNE ✓ AktifPengandingan Spesifikasi
| Parametr | MPC8572VTAVNE | MPC8572ECVTAVNE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Core Architecture | PowerPC e500 (Book E, with SPE/APU) | PowerPC e500, dual-core, 32-bit RISC |
| Number of Cores | 2 | 2 |
| Core Clock Frequency (max) | 1.5 GHz | — |
| Gambaran Suhu Operasi | 0 C to +105 C | — |
| Core Voltage | 1.1 V | 1.1 V |
| L2 Cache | 1 MB (shared) | [DATA_NEEDED: L2 cache size] |
| Memory Controller | DDR2 / DDR3 with ECC | DDR2/DDR3 with ECC (per datasheet family) |
| PCI Express | 3 x PCIe interfaces | 2x PCIe interfaces |
| Ethernet MAC | 2 x 10/100/1000 Mbps (Triple Speed) | — |
| Serial RapidIO | Yes | 2x endpoints |
| Security Engine | Integrated | SEC 4.0 (IPSec/SSL/Kasumi/Snow 3G) |
| Kemasan | 1023-ball FCBGA, 33 mm x 33 mm | 1023-ball FCBGA (33x33 mm) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL classification] | — |
| Status RoHS | compliant | [DATA_NEEDED: confirm RoHS for this part suffix] |
| Product Family | PowerQUICC III (MPC85xx) | — |
| Process Node | [DATA_NEEDED: fabrication process] | — |
| Processor Type | — | MPC85xx PowerQUICC III |
| Maximum CPU Clock | — | 1.5 GHz |
| Process Technology | — | 0.09 um CMOS |
| I/O Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Ethernet MACs | — | 4x 10/100/1000 Mbit |
| Suhu Operasi | — | [DATA_NEEDED: industrial temp grade] |