MPC8572VTAVNE vs MPC8572ECVTAVNE 对比

详细并排对比 MPC8572VTAVNE 出自 NXP Semiconductors 和 MPC8572ECVTAVNE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC8572VTAVNE MPC8572VTAVNE - PowerPC e500 Dual-Core 1.5GHz SoC | NXP | FCBGA-1023

MPC8572VTAVNE - PowerPC e500 Dual-Core 1.5GHz SoC | NXP | FCBGA-1023

MPC8572VTAVNE ✓ 量产中
NXP Semiconductors
MPC8572ECVTAVNE MPC8572ECVTAVNE - 1.5GHz Dual-Core PowerPC e500 SoC | NXP

MPC8572ECVTAVNE - 1.5GHz Dual-Core PowerPC e500 SoC | NXP

MPC8572ECVTAVNE Nrnd

规格对比

参数 MPC8572VTAVNE MPC8572ECVTAVNE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 不推荐新设计
库存状态 有库存 有库存
单价(USD) $308.00 $308.55
Manufacturer NXP Semiconductors (formerly Freescale) —
Core Architecture PowerPC e500 (Book E, with SPE/APU) PowerPC e500, dual-core, 32-bit RISC
Number of Cores 2 2
Core Clock Frequency (max) 1.5 GHz —
工作温度范围 0 C to +105 C —
Core Voltage 1.1 V 1.1 V
L2 Cache 1 MB (shared) [DATA_NEEDED: L2 cache size]
Memory Controller DDR2 / DDR3 with ECC DDR2/DDR3 with ECC (per datasheet family)
PCI Express 3 x PCIe interfaces 2x PCIe interfaces
Ethernet MAC 2 x 10/100/1000 Mbps (Triple Speed) —
Serial RapidIO Yes 2x endpoints
Security Engine Integrated SEC 4.0 (IPSec/SSL/Kasumi/Snow 3G)
封装 1023-ball FCBGA, 33 mm x 33 mm 1023-ball FCBGA (33x33 mm)
安装类型 Surface Mount (BGA) Surface Mount
MSL 等级 [DATA_NEEDED: MSL classification] —
RoHS 状态 compliant [DATA_NEEDED: confirm RoHS for this part suffix]
Product Family PowerQUICC III (MPC85xx) —
Process Node [DATA_NEEDED: fabrication process] —
Processor Type — MPC85xx PowerQUICC III
Maximum CPU Clock — 1.5 GHz
Process Technology — 0.09 um CMOS
I/O Voltage — 1.8 V / 2.5 V / 3.3 V
Ethernet MACs — 4x 10/100/1000 Mbit
工作温度 — [DATA_NEEDED: industrial temp grade]

数据手册与资源

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