MPX2102GP vs MPX2202GP Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPX2102GP disebabkan oleh NXP Semiconductors dan MPX2202GP disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPX2102GP | MPX2202GP |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | Aktif | Aktif |
| Pressure Type | Vented Gauge | Vented Gauge |
| Operating Pressure Range | 0 kPa to 100 kPa (0 PSI to 14.5 PSI) | 0 kPa to 200 kPa (0 to 29.01 PSI) |
| Maximum Overpressure | [DATA_NEEDED: maximum overpressure rating] | — |
| Full-Scale Output (VoutFS) | 40 mV at 10 V excitation | — |
| Gambaran Tegangan Output | 0 mV to 40 mV | — |
| Excitation Voltage | 10 V typical (DC) | — |
| Sensitivity | 0.4 mV/kPa nominal | — |
| Linearity | 1.0 % maximum | — |
| Pressure Port | Male 0.19 in (4.93 mm) tube | — |
| Suhu Operasi | 0 C to +85 C | -40 C to +125 C [DATA_NEEDED: confirm from datasheet curves] |
| Storage Temperature | [DATA_NEEDED: storage temperature range] | — |
| Temperature Compensation Range | 0 C to +85 C (on-chip) | — |
| Kemasan | 4-SIP Module (Unibody GP) | — |
| Jenis Pemasangan | Through-Hole SIP | Through Hole |
| Sensor Technology | Silicon piezoresistive, monolithic diaphragm | — |
| Offset (null) | 0 mV to 1 mV typical | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS compliance] |
| Maximum Overload Pressure | — | [DATA_NEEDED: maximum overload pressure] |
| Tegangan Output | — | 0 mV to 40 mV (at 10 V excitation) |
| Tegangan Pemberi Arus | — | 10 V DC nominal |
| Arus Pemberi Arus | — | [DATA_NEEDED: supply current] |
| Port Size | — | Male, 0.19 in (4.93 mm) Tube |
| Kemasan / Case | — | 4-SIP Top Port Module |
| Termination Style | — | Through-Hole (PCB) |
| Accuracy | — | [DATA_NEEDED: linearity / accuracy specification] |
| Media Compatibility | — | Dry air or non-corrosive gases (per datasheet) |
| Compensation | — | On-chip temperature compensated and calibrated |