MPXV53GC7U vs MPXV5050GP Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPXV53GC7U disebabkan oleh NXP Semiconductors dan MPXV5050GP disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPXV53GC7U - 50 kPa Uncompensated Vented Gauge Pressure Sensor | NXP
MPXV53GC7U ✓ Aktif
Pengandingan Spesifikasi
| Parametr | MPXV53GC7U | MPXV5050GP |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Sensus | Pressure Sensor, Vented Gauge | Vented Gauge Pressure Sensor |
| Operating Pressure Range | 0 kPa to 50 kPa (0 PSI to 7.25 PSI) | — |
| Pressure Port Type | Male - 0.13" (3.17 mm) Tube, Top Port | — |
| Reference Type | Vented Gauge | — |
| Jenis Output | Analog Voltage (Wheatstone bridge) | Analog, ratiometric |
| Tegangan Output | 0 mV to 60 mV at 3 V excitation | 0.2 V to 4.7 V (at 5 V supply) |
| Sensitivity (typ) | 1.0 mV/kPa at 3 V excitation | — |
| Excitation Voltage | 3 V typical (up to 10 V max per datasheet) | — |
| Input Impedance | 1.0 kΩ to 3.0 kΩ | — |
| Output Impedance | 1.0 kΩ to 3.0 kΩ | — |
| Suhu Operasi | -40 °C to +125 °C | 0C to +85C |
| Kemasan / Case | 8-DIP (0.550", 13.97 mm) through-hole, top port | — |
| Jenis Pemasangan | Through Hole | Surface Mount |
| Compensation | Uncompensated (raw bridge output) | — |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Status RoHS | Compliant | Compliant |
| Pressure Range | — | 0 kPa to 50 kPa (0 PSI to 7.25 PSI) |
| Tegangan Pemberi Arus | — | 4.75 V to 5.25 V (5 V typical) |
| Full-Scale Span | — | 4.5 V typical |
| Storage Temperature | — | [DATA_NEEDED: storage temperature range] |
| Port Style | — | Male - 0.13 in (3.17 mm) vertical side tube |
| Kemasan | — | 8-SMD, Gull Wing, Side Port (SO SOT1693-1) |
| Body Size | — | 12.06 mm x 12.06 mm x 3.38 mm |
| Lead Pitch | — | 2.54 mm |
| Signal Conditioning | — | On-chip bipolar op-amp, thin-film temp compensation |
| Min Package Quantity | — | 25 (NXP tray) |
| Min Order Quantity | — | 250 (NXP budgetary) |