MW7IC2040NBR1 vs MW7IC2040GNR1 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MW7IC2040NBR1 disebabkan oleh NXP Semiconductors dan MW7IC2040GNR1 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MW7IC2040GNR1 MW7IC2040GNR1 - 4W RF LDMOS PA, 1.8-1.99 GHz | NXP

MW7IC2040GNR1 - 4W RF LDMOS PA, 1.8-1.99 GHz | NXP

MW7IC2040GNR1 Obsolete

Pengandingan Spesifikasi

Parametr MW7IC2040NBR1 MW7IC2040GNR1
Merek NXP Semiconductors NXP Semiconductors
Kategori RF Amplifiers RF Amplifiers
Status Lingkungan Hidup Aktif Obsolete
RF Type General Purpose General Purpose / Cellular Base Station PA
Frequency Range 1930 MHz to 1990 MHz (PCS) / 1805 MHz to 1880 MHz (DCS) 1805 MHz to 1990 MHz
Test Frequency 1990 MHz —
Gain 23.5 dB (typ at 1990 MHz) —
Output Power (P1dB/avg) 4 W (family rating) —
Tegangan Pemberi Arus 24 V to 32 V —
Quiescent Supply Current 75 mA (typ) —
Kemasan / Case TO-272-16 Variant, Flat Leads TO-270-16 Variant, Gull Wing (TO-270 WBL-16)
Jenis Pemasangan Surface Mount Surface Mount (Gull Wing leads)
Technology RF LDMOS (later-generation, on-chip matching) LDMOS (Laterally Diffused MOS)
Number of Functions 1 (multi-stage integrated PA) —
Suhu Operasi [DATA_NEEDED: operating temperature range] —
Storage Temperature [DATA_NEEDED: storage temperature range] —
Modulation Support W-CDMA, GSM, EDGE, CW W-CDMA, GSM/EDGE, multi-carrier cellular
Status RoHS Compliant (per ETEI / distributor data) [DATA_NEEDED: RoHS status]
Manufacturer — NXP Semiconductors (formerly Freescale/Motorola)
Part Family — MW7IC2040 (NR1 / GNR1 / NBR1)
Device Type — RF LDMOS Wideband Integrated Power Amplifier
Output Power (CW) — 4 W typical
Power Supply Voltage — 24 V to 32 V (28 V nominal)
Arus Dalam Tentera — 75 mA (typical, per web data)
Small-Signal Gain — 23.5 dB (typical at 1.99 GHz, per web data)
On-Chip Matching — Yes (input/output 50 ohm)
Number of Stages — 2 (multi-stage integrated)
Package Body Material — Plastic / Epoxy overmold
Packaging — Tape & Reel
Gambaran Suhu Operasi — [DATA_NEEDED: operating temperature range]
ESD Protection — Yes (integrated)
Lead-Free — [DATA_NEEDED: lead-free status]
Boson Bebas — Not Compliant (per GlobalSpec listing)

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