MW7IC2040NBR1 vs MW7IC2040GNR1 비교
다음의 상세 나란히 비교: MW7IC2040NBR1 제조: NXP Semiconductors 및 MW7IC2040GNR1 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
NXP Semiconductors
MW7IC2040NBR1 - 4W RF LDMOS Wideband Power Amplifier | NXP Semiconductors
MW7IC2040NBR1 ✓ 활성사양 비교
| 파라미터 | MW7IC2040NBR1 | MW7IC2040GNR1 |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | RF Amplifiers | RF Amplifiers |
| 수명 주기 상태 | 활성 | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $15.20 | $17.50 |
| RF Type | General Purpose | General Purpose / Cellular Base Station PA |
| Frequency Range | 1930 MHz to 1990 MHz (PCS) / 1805 MHz to 1880 MHz (DCS) | 1805 MHz to 1990 MHz |
| Test Frequency | 1990 MHz | — |
| Gain | 23.5 dB (typ at 1990 MHz) | — |
| Output Power (P1dB/avg) | 4 W (family rating) | — |
| 공급 전압 | 24 V to 32 V | — |
| Quiescent Supply Current | 75 mA (typ) | — |
| 패키지 / 케이스 | TO-272-16 Variant, Flat Leads | TO-270-16 Variant, Gull Wing (TO-270 WBL-16) |
| 실장 유형 | Surface Mount | Surface Mount (Gull Wing leads) |
| Technology | RF LDMOS (later-generation, on-chip matching) | LDMOS (Laterally Diffused MOS) |
| Number of Functions | 1 (multi-stage integrated PA) | — |
| 동작 온도 | [DATA_NEEDED: operating temperature range] | — |
| Storage Temperature | [DATA_NEEDED: storage temperature range] | — |
| Modulation Support | W-CDMA, GSM, EDGE, CW | W-CDMA, GSM/EDGE, multi-carrier cellular |
| RoHS 상태 | Compliant (per ETEI / distributor data) | [DATA_NEEDED: RoHS status] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale/Motorola) |
| Part Family | — | MW7IC2040 (NR1 / GNR1 / NBR1) |
| Device Type | — | RF LDMOS Wideband Integrated Power Amplifier |
| Output Power (CW) | — | 4 W typical |
| Power Supply Voltage | — | 24 V to 32 V (28 V nominal) |
| 대기 전류 | — | 75 mA (typical, per web data) |
| Small-Signal Gain | — | 23.5 dB (typical at 1.99 GHz, per web data) |
| On-Chip Matching | — | Yes (input/output 50 ohm) |
| Number of Stages | — | 2 (multi-stage integrated) |
| Package Body Material | — | Plastic / Epoxy overmold |
| Packaging | — | Tape & Reel |
| 동작 온도 범위 | — | [DATA_NEEDED: operating temperature range] |
| ESD Protection | — | Yes (integrated) |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| 할로겐 프리 | — | Not Compliant (per GlobalSpec listing) |