XC6SLX75-3FG676I vs XC6SLX75-3FG676C Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci XC6SLX75-3FG676I disebabkan oleh AMD dan XC6SLX75-3FG676C disebabkan oleh AMD. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

AMD
XC6SLX75-3FG676C XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA

XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA

XC6SLX75-3FG676C ✓ Aktif

Pengandingan Spesifikasi

Parametr XC6SLX75-3FG676I XC6SLX75-3FG676C
Merek AMD AMD
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Unknown Aktif
Device Type Field Programmable Gate Array (FPGA) FPGA
FPGA Family Spartan-6 LX —
Logic Cells 74,637 cells 74,637 cells
Configurable Logic Blocks 5,831 CLBs 5,831 CLBs
Maximum Frequency 862 MHz —
I/O Count 408 I/O —
Process Technology 45 nm CMOS 45 nm CMOS
Kemasan 676-ball FCBGA —
Package Body Size 27 mm x 27 mm —
Ball Pitch 1 mm 1.0 mm
Terminal Count 676 terminals 676 terminals
Temperature Grade Industrial —
Speed Grade -3 -3
Surface-Mount Type Ball Grid Array (BGA) —
Verified Distributor Price USD 67.1347 per unit —
LCSC Availability In stock —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
REACH Status [DATA_NEEDED: REACH status] [DATA_NEEDED: REACH status]
Lead-Free Status [DATA_NEEDED: lead-free status] [DATA_NEEDED: lead-free status]
Automotive Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Device Family — Spartan-6 LX
Internal Frequency — 667 MHz
Tegangan Pemberi Arus — [DATA_NEEDED: supply voltage]
Suhu Operasi — 0°C to 85°C (32°F to 185°F)
Package Type — 676-BGA
Package Description — FBGA-676
Package Dimensions — 27 mm × 27 mm
Package Family — FBGA
Jenis Pemasangan — Surface mount
I/O Standard — [DATA_NEEDED: supported I/O standards]
Block RAM — [DATA_NEEDED: block RAM resources]
DSP Resources — [DATA_NEEDED: DSP resources]
Configuration Method — [DATA_NEEDED: configuration method]

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