10AS057K3F35E2SG - Arria 10 SX SoC FPGA, 570K LE, 1152-FBGA
MPN: 10AS057K3F35E2SG ✓ פעיל10AS057K3F35E2SG סקירה
An SoC FPGA is a hybrid device that combines a general-purpose processor subsystem with programmable logic on a single die. The processor subsystem (hard CPU cores + peripherals + memory controller + interconnect) handles OS, control plane, and software-defined tasks, while the FPGA fabric accelerates parallel datapath, DSP, and I/O functions. This heterogeneous integration reduces board area, lowers latency between CPU and FPGA, and simplifies security/IP protection by keeping proprietary algorithms in hardware.
The Arria 10 SX family supports up to 1.5 GHz ARM Cortex-A9 cores, floating-point operations, and a rich HPS peripheral set including Ethernet, USB, DDR memory controllers, and high-speed serial interfaces. The 570K logic element count places this device in the mid-density tier of the Arria 10 SX lineup, providing a balanced trade-off between logic capacity, DSP throughput, and power consumption for mid-to-high complexity embedded designs.
This part is specified for the industrial temperature range with the F35 (35x35 mm) package outline, making it suitable for embedded vision, industrial control, and communications infrastructure. The 'K3' suffix denotes specific speed/grade combinations and the E2SG suffix encodes industrial temperature, lead-free, and RoHS-compliant packaging.
When designing with this SoC FPGA, ensure the PCB BGA footprint matches the 1 mm pitch 1152-ball FC-FBGA layout and use a multi-layer stackup with continuous ground planes for signal integrity. The HPS requires dedicated DDR3/DDR4 memory routing; follow Intel's pin connection guidelines and PCB design rules.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
חלופות תחליף ישיר עבור 10AS057K3F35E2SG — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם 10AS057K3F35E2SG (אותו גורם צורה וטביעת רגל) — שונים ב Speed Grade, Package, Mounting Type, Operating Temperature, Logic Elements.
10AS057K3F35E2LG
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←10AS057K2F35E2SG
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←10AS057K2F35E2LG
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←10AS057K2F35I2SG
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←10AS057K2F35I2LG
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←10AS048K3F35E2SG
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←10AS057K3F35E2SG דירוגים מרביים ומאפיינים חשמליים
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 |
| Process Technology | 20 nm |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Core Voltage | 0.9 V |
| מארז | 1152-pin FC-FBGA (35x35 mm) |
| סוג הרכבה | Surface Mount (BGA) |
| טמפרטורת פעולה | 0 C to +85 C (industrial) |
| Lead-Free / RoHS | Yes / Compliant |
| Core Speed | up to 1.5 GHz |
מדריך תצורת פינים של 10AS057K3F35E2SG 1152-pin fc-fbga (35x35 mm)
תצורת פינים עבור 10AS057K3F35E2SG (מארזת 1152-pin fc-fbga (35x35 mm)). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור 10AS057K3F35E2SG.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
10AS057K3F35E2SG מתאים עבור 6 יישוםs: Industrial Machine Vision, 5G Baseband Processing, Automotive ADAS Sensor Fusion, Medical Imaging Systems, Broadcast Video Processing, Aerospace Avionics.
Industrial Machine Vision
The 10AS057K3F35E2SG suits industrial machine vision pipelines combining image preprocessing, feature extraction, and CNN inference with HPS-side control software. The 570K logic elements accommodate multiple parallel pixel pipelines at 1080p/4K resolutions, while the 1.5 GHz dual-core ARM Cortex-A9 runs Linux for camera control, protocol handling, and result aggregation. The integrated HPS eliminates the need for a separate processor board, reducing BOM and latency for real-time vision feedback in factory automation lines.
מומלץ
5G Baseband Processing
For 5G baseband and radio unit designs, the 10AS057K3F35E2SG offers the DSP throughput and HPS integration needed for PHY-layer acceleration. The Arria 10 SX DSP blocks handle LTE/5G channel estimation, FFT/iFFT, and LDPC encoding/decoding at rates up to several hundred MHz, while the ARM cores run the MAC scheduler, RF control, and CPRI/eCPRI stack. The 1152-ball FC-FBGA supports the multi-gigabit transceiver count and PCIe Gen2/3 interfaces required for baseband cards.
מומלץ
Automotive ADAS Sensor Fusion
In automotive advanced driver-assistance systems, the 10AS057K3F35E2SG fuses radar, lidar, and camera data with deterministic latency. The 570K LE fabric runs sensor preprocessing and object tracking algorithms in hardware, while the HPS executes the sensor fusion middleware, vehicle network stack (CAN, Automotive Ethernet), and perception software. Designers should note that Arria 10 SX is not AEC-Q100 qualified; for production ADAS, use the Cyclone V or Arria V automotive variants.
מומלץ
Medical Imaging Systems
For ultrasound, CT, and MRI front-end processing, the 10AS057K3F35E2SG delivers the deterministic real-time performance required by medical imaging pipelines. The FPGA fabric implements beamforming, FIR filtering, and image reconstruction at line rates exceeding 200 MHz, while the HPS runs the user interface, DICOM stack, and storage management on Linux. The industrial temperature range and lead-free FC-FBGA package suit medical equipment housings with strict reliability and biocompatibility requirements.
מומלץ
Broadcast Video Processing
Broadcast studios and production switchers leverage the 10AS057K3F35E2SG for SDI-based video routing, color space conversion, and overlay composition. The Arria 10 SX DSP blocks and fabric implement real-time video effects at 4K/8K rates, while the HPS runs the configuration UI and SNMP monitoring. The 1152-ball FC-FBGA supports multiple 12G-SDI transceiver channels and HDMI 2.0/DisplayPort interfaces needed in professional AV equipment.
מומלץ
Aerospace Avionics
In aerospace applications, the 10AS057K3F35E2SG supports flight control computers, mission processing, and sensor interfaces with radiation-tolerant design practices. The HPS runs the ARINC 653 partition scheduler and avionics bus stacks, while the FPGA fabric implements deterministic I/O handling for MIL-STD-1553, ARINC 429, and Ethernet. Designers should verify the specific lot against radiation requirements and use the industrial temperature variant for civil aviation.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור 10AS057K3F35E2SG — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | 10AS057K3F35E2LG | 10AS057K2F35E2SG | 10AS048K3F35E2SG |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-FBGA FC (35x35) | 1152-FBGA FC (35x35) - same | 1152-FBGA FC (35x35) - same | 1152-FBGA FC (35x35) - same |
| Logic Elements | 570,000 | 570,000 | 570,000 | 480,000 |
| Speed Grade | K3 (fastest) | K3 | K2 (~10-15% slower Fmax) | K3 |
| Hard Processor Subsystem | Dual ARM Cortex-A9 @ 1.5 GHz | Same HPS | Same HPS | Same HPS |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm |
| Temperature Grade | Industrial 0 to 85 C | Industrial 0 to 85 C | Industrial 0 to 85 C | Industrial 0 to 85 C |
| Approximate Unit Price (qty 1) | $4,850 USD | ~$4,850 USD | ~$4,200 USD (K2 discount) | ~$4,100 USD (lower density) |
מבדילים עיקריים
- HPS integration eliminates external processor (לעומת10AS032H3F35E2SG)
- Higher logic capacity than lower-density variant (לעומת10AS048K3F35E2SG)
- K3 speed grade offers tighter timing margin (לעומת10AS057K2F35E2SG)
הערות תכנון
The 1152-ball FC-FBGA uses 1.0 mm ball pitch. Per IPC-7351 and Intel's package guidelines, use 0.6 mm pad diameter with 0.4 mm solder mask openings and a microvia-in-pad stackup (laser-drilled 0.1 mm vias) to escape the inner rows. Allocate at least 6 PCB layers and place a continuous GND plane directly under the BGA to provide a low-impedance return path and reduce SSO noise.
Estimated: at 100% logic utilization and 1.5 GHz HPS load, the 10AS057K3F35E2SG consumes roughly 12-15 W. With a typical FC-FBGA theta_JA of approximately 11-13 C/W (4-layer board, no airflow), junction temperature may rise 130-180 C above ambient. A heatsink, heat spreader, or 200-400 LFM airflow is required to maintain junction below 100 C for reliable long-term operation.
Do not confuse the SX (with HPS) suffix with the GX (transceiver-focused) or GT (high-speed serial) variants in the Arria 10 family. All three families use the same F35 1152-ball package, but only the SX parts include the hard processor subsystem. Verify the full ordering code before PCB assembly because the SX and GX variants have different pin multiplexing for HPS signals.
מידע על תאימות
RoHS-compliant per ordering code E2SG. Not AEC-Q100 qualified - Arria 10 SX is not an automotive-grade FPGA family.