Intel

EP2SGX130GF1508C4N - Stratix II GX 132K LEs FPGA | Intel / Altera

Name: EP2SGX130GF1508C4N - Stratix II GX 132K LEs FPGA | Intel / Altera
Brand: Intel
SKU: EP2SGX130GF1508C4N

MPN: EP2SGX130GF1508C4N ✗ Akhir Hayat

1.2 V Vdss 1508-ball FCBGA (FineLine BGA) Package 717 MHz Speed

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MOQ: 1 |

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EP2SGX130GF1508C4N Ringkasan

The Intel (formerly Altera) EP2SGX130GF1508C4N is a high-density Stratix II GX Field Programmable Gate Array (FPGA) integrating 132,540 logic elements, 6,747,840 bits of embedded memory, and 734 user I/Os in a 1508-ball FineLine BGA (FCBGA) package. Built on a 90 nm CMOS process with 1.2 V core supply, it delivers up to 717 MHz internal operation and is designed for high-throughput serial connectivity plus parallel DSP workloads. The integrated 6.375 Gbps transceivers make it a classic platform for early-2000s high-speed serial bridging.

A Field Programmable Gate Array (FPGA) is a class of programmable logic device containing configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, block RAM, and hardened I/O serdes that can be rewired post-manufacturing. FPGAs sit in the hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II family specifically targets high-performance applications by combining a unique adaptive logic module (ALM) architecture with embedded transceivers, on-chip memory, and dedicated multipliers.

Key features include 132,540 logic elements organized as 6,627 LABs, 6747840 total RAM bits, 8 PLLs, 4 DLLs, and configurable high-speed transceivers capable of multiple protocol rates. The device supports LVDS, LVTTL, LVCMOS, PCI, PCI-X, and HSTL I/O standards and includes dedicated hardware multipliers and DSP blocks. The FCBGA-1508 FineLine BGA package offers vertical migration within the Stratix II GX family, allowing density upgrades without PCB changes.

The Stratix II GX architecture introduced the ALM (Adaptive Logic Module) as its core logic unit, replacing the 4-input LUT of previous generations with a fracturable 8-input equivalent that improves DSP packing density and reduces logic fragmentation. Combined with the 90 nm process node, this architecture achieved industry-leading performance at launch.

Typical applications include high-speed serial interface prototyping, PCI Express endpoint development, telecommunications backplane bridging, multi-gigabit serial I/O expansion, and DSP-intensive signal processing cards in test and measurement equipment. Its combination of logic density and on-chip transceivers made it a mainstay for OC-48 and early OC-192 designs, radar signal processing, and broadcast video routing.

When designing with this FPGA, ensure proper power sequencing for the 1.2 V core, 2.5 V/3.3 V auxiliary, and transceiver supplies, since out-of-order power-up can latch-up I/O structures. Thermal management must account for high quiescent current under heavy transceiver utilization; thermal balls in the BGA substrate must be soldered to a grounded thermal via array for proper dissipation.

This page synthesizes Stratix II GX family positioning, drop-in density-grade alternatives within the same FCBGA-1508 footprint, and practical design guidance beyond the marketing datasheet, helping engineers evaluate lifecycle risk and migration paths for legacy designs.

Pilihan pengganti yang segera untuk EP2SGX130GF1508C4N — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.

Varietas dalam siri ini

Model serupa yang kompatibel dengan pengganti yang segera EP2SGX130GF1508C4N (sama faktor bentuk dan kaki) — berbeza dalam Package, Speed Grade, RoHS Status, Family, Total RAM Bits.

EP2S130F1508C4N

Altera

Package: 1,508-ball FBGA

Speed Grade: C4 (commercial)

RoHS Status: Compliant (N suffix)