PI7C7300ANAE - 3-Port PCI Bridge Interface IC | Diodes Incorporated
MPN: PI7C7300ANAE ✓ AktifPI7C7300ANAE Ringkasan
A PCI-to-PCI bridge is a specialized interface integrated circuit within the broader PCI interface-controller hierarchy. It sits electrically between two PCI bus segments and allows compatible PCI devices or subsystems on the secondary side to communicate with the host-side PCI bus. Such bridges are especially relevant to embedded computing, industrial control, communications equipment, and legacy PCI expansion systems where a bus translation function is required but a newer host-to-PCI interface is not appropriate.
The PI7C7300ANAE provides three PCI ports for designing systems around multiple downstream PCI agents. This makes it useful where a central host must coordinate several bus participants, including endpoint devices, bridges, or controller functions implemented in an embedded subsystem. Because the device uses a large-array BGA package, its implementation depends on multilayer PCB routing, controlled impedance, solid thermal management, and careful high-speed signal routing rather than a simple two-row peripheral package.
The 272-ball PBGA is the principal mechanical constraint when evaluating this component. Its 27 x 27 mm footprint provides dense access to the PCI bridge's power, ground, clock, control, and data contacts, but it also demands exact land-pattern compliance, ball-to-pad alignment, and assembly-process validation. Tube packaging is listed in the verified distributor data, so procurement and assembly planning should account for the component's handling requirements before committing to a production build.
Typical applications include embedded PCI backplanes, industrial controller platforms, communications gateways, test systems, and specialized expansion chassis that retain conventional PCI connectivity. In these systems, the PI7C7300ANAE serves as the central bus-routing element rather than as a general-purpose processor, memory device, or isolated interface transceiver. Adjacent Ethernet, USB, serial, and industrial interface components may support the wider system, but the bridge remains the component responsible for PCI-to-PCI transaction forwarding.
Designers should obtain the manufacturer datasheet and verify all electrical, timing, clocking, power, thermal, and pin-level requirements before schematic capture or PCB layout. The high-density BGA also benefits from assembly-capability review, impedance-controlled stack-up selection, via placement around the device, and adequate power-plane distribution. This page consolidates verified distributor and datasheet-link information, purchasing considerations, application context, and the limits of the currently available substitute data.
Pilihan pengganti yang segera untuk PI7C7300ANAE — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Tiada pilihan pengganti yang segera untuk produk ini.
Minta AlternatifPI7C7300ANAE Penilaian maksimum & Ciri-ciri Elektrik
| Device Type | PCI-to-PCI bridge interface IC |
| PCI Port Count | 3 ports |
| Bus Architecture | PCI-to-PCI bridge |
| Package Type | 272-PBGA |
| Package Designation | 272-BBGA |
| Package Dimensions | 27 x 27 mm |
| Ball Count | 272 balls |
| Jenis Pemasangan | Surface mount |
| Packaging | Tube |
| Lead-Free Status | Lead free |
Panduan Konfigurasi Pin PI7C7300ANAE 27 x 27 mm
Konfigurasi pin untuk PI7C7300ANAE (27 x 27 mm pakai). Peranti kuasa ini mempunyai terminal kawat, buang, dan sumber. Untuk pakai non-polarized, rujuk dokumen pengeluar untuk orientasi pin 1 tepat dan perincian kebentuk.
Tiada data garisan pin yang diperoleh untuk PI7C7300ANAE.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
PI7C7300ANAE patut untuk 6 aplikasis: Embedded PCI Backplane Systems, Industrial Control Platforms, PCI Communications Gateways, Legacy PCI Test Equipment, Industrial Data Acquisition Systems, Specialized Expansion Chassis.
Embedded PCI Backplane Systems
The PI7C7300ANAE fits embedded backplanes that require one conventional PCI host segment to communicate with multiple downstream PCI resources. Its verified three-port PCI-to-PCI configuration provides a defined bridge structure for endpoint controllers, communication devices, or additional bus functions implemented in a control system. The 272-PBGA package concentrates the required power, ground, clock, control, and PCI signal connections in a 27 x 27 mm area. Before layout begins, engineers must obtain the exact 272-ball map, impedance requirements, timing constraints, and power specifications from the manufacturer datasheet. PCB planning should also confirm that the selected assembly line can place and inspect a 272-ball BGA, while thermal analysis should account for the bridge's actual dissipation under the intended traffic load.
Disebarkan
Industrial Control Platforms
Industrial controllers often retain conventional PCI connectivity for motion, I/O, measurement, and communications modules. The PI7C7300ANAE is applicable when one PCI host must coordinate three PCI-facing resources through a centralized bridge rather than separate point-to-point controllers. Its three-port PCI-to-PCI architecture supports a structured backplane topology and can simplify system organization compared with an unrelated adapter chain. Qualification for an industrial environment is not established by the available snippets, so operating temperature, electrical limits, reliability information, and lifecycle commitments must be checked in the manufacturer documentation. Layout should use the manufacturer land pattern, preserve specified clock and signal integrity, provide low-impedance power distribution, and be validated against the assembled module's operating-temperature range.
Disebarkan
PCI Communications Gateways
The PI7C7300ANAE can serve as the PCI-bus routing element in a communications gateway that connects legacy PCI agents to a host processor or embedded controller. The verified three-port arrangement allows a system architect to partition several PCI resources behind one bridge interface. This topology is useful where multiple protocol converters, acquisition engines, or storage controllers communicate over a shared PCI fabric. Because the available data does not state transfer rate, latency, clock requirements, or power consumption, system bandwidth and timing claims should not be made without the manufacturer datasheet. Signal-integrity review should include return paths, layer transitions, via symmetry, and clock distribution, while firmware must be validated against the bridge's required initialization and operating configuration.
Disebarkan
Legacy PCI Test Equipment
The PI7C7300ANAE is relevant to test and diagnostic platforms that must retain conventional PCI agents for proven measurement modules, interface cards, or laboratory fixtures. Three PCI ports allow a central test controller to communicate with multiple downstream PCI resources while maintaining a recognizable bus hierarchy. This can be valuable when redesigning around a modern host would require replacing tested peripherals. The device should be selected only after confirming that the test system can accommodate a 272-ball PBGA and the assembly yield requirements associated with that package. Engineers also need to review the datasheet for operating conditions, initialization requirements, timing margins, and power sequencing. Functional validation should cover normal traffic, error handling, bus arbitration, and the intended fault-injection scenarios for the completed tester.
Disebarkan
Industrial Data Acquisition Systems
A PI7C7300ANAE-based subsystem can organize multiple PCI-compatible acquisition or signal-processing resources behind a three-port PCI-to-PCI bridge. This topology is useful when an industrial controller needs deterministic partitioning of acquisition engines, interface adapters, or local memory resources without changing an established PCI ecosystem. The IC's verified function is a three-port PCI bridge, but the supplied data does not specify bandwidth, acquisition latency, or synchronization behavior. Those characteristics must be confirmed from the manufacturer datasheet and then compared with the sampling requirements of the selected modules. PCB implementation should account for the 272-BBGA geometry, adequate decoupling at every supply ball group, continuous return-plane paths, and clock-source distribution. Thermal and power testing should be performed at the highest expected channel count and sustained PCI traffic rather than under idle conditions.
Disebarkan
Specialized Expansion Chassis
The PI7C7300ANAE is applicable to a specialized expansion chassis that retains PCI-based cards or modules while providing a central three-port bridge architecture. Such systems may combine computation, storage, communications, and proprietary instrumentation behind a host-visible PCI structure. The verified 3-port function provides a clear basis for topology planning, but it does not alone establish board-level compatibility. Mechanical integration must account for the 27 x 27 mm package, and the PCB must follow the manufacturer land pattern exactly. Before committing, engineers should verify pinout, electrical limits, timing, initialization, thermal performance, and long-term availability from the manufacturer documentation. Prototype builds should include boundary-scan or continuity checks, power-rail sequencing tests, and PCI compliance testing across all three ports before production replication.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk PI7C7300ANAE — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini |
|---|---|
| Package | 272-PBGA (27 x 27 mm) |
| Brand | Diodes Incorporated |
| Device Type | PCI-to-PCI bridge interface IC |
| PCI Port Count | 3 ports |
| Ball Count | 272 balls |
| Package Dimensions | 27 x 27 mm |
| Packaging | Tube |
| Lead-Free Status | Lead free |
Penyeberangsung Jelas
- Three-port PCI-to-PCI bridge configuration (vsNo verified drop-in alternative was identified)
- High-density 272-ball package with 27 x 27 mm body (vsNo verified drop-in alternative was identified)
- Directly identified distributor sourcing (vsNo verified drop-in alternative was identified)
Catatan Desain
Treat the PI7C7300ANAE land pattern as a manufacturer-controlled 272-ball footprint and do not infer it from a generic 272-BGA library. The verified package is 27 x 27 mm, but ball pitch, pad definition, power-ball grouping, and assembly land pattern are not included in the supplied snippets. Obtain the official package drawing and compare every ball position before PCB release. Also confirm that the board stack-up, solder-mask definition, and assembly process are suitable for the device's BGA technology.
Plan the PCI data, control, and clock nets as a complete signal-integrity problem rather than routing them as ordinary low-speed digital signals. Use the manufacturer's pin assignments and recommended layer transitions, preserve continuous reference planes, minimize stubs and unnecessary via transitions, and control impedance on every externally exposed PCI path. Because the supplied data does not state operating frequency or timing limits, the actual routing rules must be derived from the manufacturer datasheet and verified with the intended board construction.
Reserve multiple input and output connection points for every supply rail, following the exact manufacturer ball-group map. Place local decoupling capacitors at the device-side power balls and provide low-impedance plane connections for both power and ground. Do not infer current limits, rail voltages, or permissible capacitor values from the distributor listings. Validate steady-state and transient current against the datasheet, and use plane-current or thermal analysis to identify any hot spots around the 272-ball footprint.
The 27 x 27 mm PBGA is compact relative to the number of balls it contains, so local heat spreading and board copper matter. The verified snippets do not provide power dissipation, junction-temperature limits, or thermal resistance, so a numerical thermal conclusion cannot be made from the available data. After obtaining those specifications, evaluate worst-case bridge traffic and ambient temperature, consider exposed thermal features only as directed by the manufacturer drawing, and avoid placing heat sources immediately beneath the device without a validated thermal strategy.
Do not treat a 272-ball BGA package as proof of pin compatibility. A substitute can have the same body size and ball count while assigning power, ground, clock, control, and PCI signals differently. Likewise, the verified PI7C7300ANAE product page does not establish that any third-party device is a drop-in replacement. Require a manufacturer-provided or formally verified pin-to-pin comparison, electrical timing review, package drawing, assembly-process approval, and lifecycle commitment before approving an alternative.
Maklumat Kesediaan
The verified distributor specification identifies the PI7C7300ANAE as lead free. The supplied data does not provide explicit RoHS, REACH, halogen-free, conflict-minerals, or automotive qualification statements. AEC-Q100 is not applicable because this is a conventional PCI interface bridge rather than an automotive-qualified device in the supplied evidence.
