XC3S200-4PQG208I - 200K Gate Spartan-3 FPGA, 208-Pin PQFP | AMD
MPN: XC3S200-4PQG208I ✓ AktifXC3S200-4PQG208I Ringkasan
A field-programmable gate array is a reconfigurable digital integrated circuit whose logic fabric, interconnect and I/O blocks are defined by a bitstream loaded from a serial configuration memory. Spartan-3 sits in the low-cost FPGA tier of the hierarchy FPGA > programmable logic > reconfigurable semiconductor, aimed at volume cost-sensitive designs rather than maximum performance.
Key features of this device include 4,320 logic cells organized as 480 configurable logic blocks, 4,320 flip-flops, 20 dedicated block RAM of 18 Kbit each, and 20 dedicated 18x18 multiplier blocks for DSP-style arithmetic. The fabric delivers 630 MHz performance on the -4 speed grade while consuming only 1.2 V at the core, which simplifies thermal design in industrial enclosures.
Technically the device combines a 90 nm CMOS process with a selectively-bonded 200,000-gate architecture, 141 user I/O, four 6 Mbit block RAM resources scaled to the 4320-cell configuration, and dedicated multiplier/adder logic. Configuration is by bitstream from standard SPI or parallel PROG flash, and the device supports readback, boundary scan (JTAG) and MultiBoot reconfiguration for field updates.
Typical applications include industrial automation and PLC control logic, motor drive and servo sequencing, sensor signal pre-processing, industrial networking gateways, embedded display control, and low-cost instrumentation front ends where a 208-pin PQFP avoids fine-pitch BGA assembly costs.
A key design consideration is that the Spartan-3 family is a mature, mature-node technology: verify supply continuity and any migration path to a newer family before starting a long-volume program, and reserve PCB footprint space for the PQFP thermal and pin-1 orientation requirements.
This page brings together the manufacturer and distributor specification set, a qualified drop-in alternative list, and practical design notes covering configuration, decoupling, JTAG access and footprint handling that are not consolidated in a single datasheet.
Pilihan pengganti yang segera untuk XC3S200-4PQG208I — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Varietas dalam siri ini
Model serupa yang kompatibel dengan pengganti yang segera XC3S200-4PQG208I (sama faktor bentuk dan kaki) — berbeza dalam Device Type, System Gates, Logic Cells, Core Supply Voltage, Process Technology.
XC3S200-4PQG208C
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
XC3S200-5PQG208C
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →XC3S250E-4PQG208I
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
XC3S400-4PQG208C
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →EP2C200F208
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
XC3S200-4PQG208I Penilaian maksimum & Ciri-ciri Elektrik
| Device Type | Spartan-3 Field-Programmable Gate Array (FPGA) |
| System Gates | 200,000 gates |
| Logic Cells | 4,320 cells |
| Configurable Logic Blocks | 480 CLBs |
| Flip-Flops | 4,320 |
| Frekuensi Klock Maksimum | 630 MHz |
| Speed Grade | -4 (4 ns) |
| Core Supply Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| User I/O Pins | 141 |
| Package Type | 208-pin PQFP (BFQFP) |
| Temperature Grade | Industrial (-40C to +100C) |
| Dedicated Block RAM | 20 x 18 Kbit (4,320 x 36-bit equivalent) |
| Dedicated Multipliers | 20 x 18x18 multiplier blocks |
| Jenis Pemasangan | Surface Mount |
| Configuration Support | Serial (SPI) or parallel PROG bitstream |
| JTAG Boundary Scan | Yes (MGTAP/EXTEST) |
Panduan Konfigurasi Pin XC3S200-4PQG208I 208-pin pqfp (bfqfp)
Konfigurasi pin untuk XC3S200-4PQG208I (208-pin pqfp (bfqfp) pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk XC3S200-4PQG208I.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
XC3S200-4PQG208I patut untuk 6 aplikasis: Industrial Automation and PLC Control Logic, Motor Drive and Servo Sequencing, Sensor Signal Pre-Processing, Embedded Networking and Protocol Gateway, Programmable Logic Controller and Timing Module, Instrumentation and Test Equipment Front Panel.
Industrial Automation and PLC Control Logic
The XC3S200-4PQG208I is well matched to industrial PLC and machine-control front ends because the 141 user I/O in a 208-pin PQFP package can absorb discrete sensors, solenoid outputs and limit switches without a companion I/O expander. At 4,320 logic cells and 630 MHz, it holds several parallel sequencers, a state machine and a communications UART comfortably, and the industrial temperature grade covers factory ambient conditions. The 20 dedicated multipliers allow shaft and pulse counting arithmetic on-chip, removing a separate DSP from the bill of materials.
Disebarkan
Motor Drive and Servo Sequencing
In stepper, BLDC and servo drive electronics the XC3S200-4PQG208I handles the deterministic half of the control loop: commutation table lookup, current-loop PWM generation and fault interlocks. The dedicated 18x18 multiplier blocks compute position error and proportional/derivative terms far faster than a soft DSP loop, and 141 I/O provide enough encoder and Hall-sensor inputs for multi-axis panels. Industrial temperature operation protects the timing margins in cabinets close to motor drives.
Disebarkan
Sensor Signal Pre-Processing
The XC3S200-4PQG208I is used as a digital front end for transducers, weighing systems and vibration monitors where analog conditioning is already in place but scaling, filtering and linearisation are digital. Block RAM holds multi-sample windows for moving-average and FIR filtering, while the 20 multipliers support gain calibration and least-squares correction on the fly. Because the same part runs at 630 MHz with a 1.2 V core, it fits low-power handheld instruments without a separate DSP package.
Disebarkan
Embedded Networking and Protocol Gateway
Protocol conversion gateways for industrial Ethernet, serial-to-fieldbus bridging and legacy equipment retrofits fit the XC3S200-4PQG208I because 4,320 logic cells are enough to run CRC engines, frame buffers and two independent UART or SPI interfaces in parallel. Block RAM absorbs packet buffering while the multipliers accelerate checksum generation. Industrial grade ensures the gateway keeps running in unheated cabinets, and the 208-pin PQFP package avoids the fine-pitch BGA assembly cost that hurts low-volume gateway products.
Disebarkan
Programmable Logic Controller and Timing Module
For PLC and timing modules the XC3S200-4PQG208I acts as a soft-logic engine: the 480 CLBs and 4,320 flip-flops implement latching logic, timers and counters, and the dedicated block RAM holds recipe and parameter data across power cycles. The 141 I/O let one device replace several discrete relay-logic boards. Because the part is specified industrial grade, it operates reliably in the temperature swings typical of machine rooms where commercial-grade parts drift or fail.
Disebarkan
Instrumentation and Test Equipment Front Panel
Test and measurement front panels built around the XC3S200-4PQG208I can host a display controller, keypad scan, stepper-driven knob and measurement post-processing in a single device. The 141 I/O cover display and keypad signals, and the multipliers assist in fast digital filtering of measurement results. A 1.2 V core plus 90 nm process keeps dissipation modest in rack-mounted instruments, and the mature, well-documented Spartan-3 tool flow shortens bring-up for instrumentation teams.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk XC3S200-4PQG208I — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | XC3S200-4PQG208C | XC3S200-5PQG208C | XC3S250E-4PQG208I | XC3S400-4PQG208C | EP2C200F208 |
|---|---|---|---|---|---|---|
| Package | 208-pin PQFP (BFQFP) | 208-pin PQFP - same | 208-pin PQFP - same | 208-pin PQFP - same | 208-pin PQFP - same | 208-pin PQFP - same |
| Brand | AMD | AMD | AMD | AMD | AMD | Intel |
| System Gates | 200,000 gates | 200,000 gates | 200,000 gates | Higher density enhanced Spartan-3 class | 400K-class density, roughly double | 200K-class density |
| Logic Cells | 4,320 cells (480 CLBs) | 4,320 cells | 4,320 cells | Higher density | Roughly double the XC3S200 cell count | Comparable 200K-class cell count |
| User I/O | 141 I/O | 141 I/O | 141 I/O | Similar I/O budget in the same outline | Similar I/O budget in the same outline | Comparable I/O count |
| Speed Grade / fmax | -4 grade, 630 MHz | -4 grade, 630 MHz | -5 grade, 725 MHz | -4 grade | -4 grade | Comparable speed class |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm-class CMOS |
| Temperature Grade | Industrial (I) | Commercial (C) | Commercial (C) | Industrial (I) | Commercial (C) | Industrial (I) |
| Configuration / Bitstream Compatibility | Spartan-3 bitstream, same family as XC3S200-4PQG208C | Directly compatible, same bitstream | Compatible bitstream for same density | Enhanced Spartan-3 bitstream, re-synthesis required | Spartan-3 bitstream for a different density | Vendor-specific configuration, full re-synthesis required |
Penyeberangsung Jelas
- Industrial temperature rating in the same drop-in footprint as the cheaper commercial part (vsXC3S200-4PQG208C)
- Headroom for timing closure without a footprint change (vsXC3S200-5PQG208C)
- Density upgrade path in an identical 208-PQFP land pattern (vsXC3S400-4PQG208C)
- No re-synthesis needed for an equivalent-cost alternative (vsEP2C200F208)
Catatan Desain
Treat the 208-pin PQFP as a fine-pitch assembly constraint: 0.5 mm lead pitch on a 26 x 26 mm body leaves narrow solder-mask dams, so use a 6 mil (0.15 mm) trace and space rule with filled vias under the package only if your assembler supports them. Route every VCC and GND pin to a solid plane, place a 0.1 uF X7R ceramic decoupling capacitor at each supply pin, and add 10 uF bulk capacitance per supply rail to control 1.2 V core droop during configuration.
The Spartan-3 core runs at 1.2 V while the I/O banks run at the external supply level, so budget two separate rails rather than a single 1.2 V feed. Estimated core current for a utilisation near 50 percent is roughly 100 mA, which at 1.2 V is about 0.12 W; a 3.3 V bank at 30 mA adds roughly 0.10 W. Confirm the actual static and dynamic currents in the Spartan-3 power estimator for your design and size the 1.2 V regulator for at least double the average draw to cover configuration bursts.
Two frequent mistakes in Spartan-3 designs are assuming a commercial-temperature part will survive a factory cabinet and assuming an identical part number guarantees an identical bitstream. Verify the temperature suffix against the worst-case enclosure temperature, and re-run the timing analysis after any speed-grade change from -4 to -5 because the faster grade shifts power and heat rather than timing constraints. Also confirm MultiBoot and JTAG access remain available after the first-stage configuration if field updates are planned.
Reserve a dedicated configuration memory footprint next to the FPGA even if the first prototype is programmed via JTAG, because production boards will normally boot from SPI flash. Keep the JTAG chain accessible, place the series termination resistors on configuration lines close to the driver, and isolate noisy motor-drive or switching-regulator nodes away from the 1.2 V core routing to prevent false configuration starts in electrically noisy cabinets.
Maklumat Kesediaan
Compliance status for this specific suffix was not stated in the manufacturer or distributor listings; check the AMD material declaration for the exact part number before release. The device is an industrial-temperature industrial/electronics part rather than an automotive-qualified device, so AEC-Q100 does not apply.
