XC6SLX16-3CSG324I - 45nm Spartan-6 FPGA | AMD
MPN: XC6SLX16-3CSG324I ✓ AktifXC6SLX16-3CSG324I Ringkasan
A field-programmable gate array is a semiconductor whose digital logic, interconnect, memory blocks, and input/output behavior are configured after manufacture. Within the programmable-logic hierarchy, an FPGA sits above fixed-function logic and combines configurable logic elements with block RAM, digital clock managers, and programmable I/O. This architecture allows one board design to support multiple protocols or algorithms through a configuration bitstream rather than a redesign of a custom ASIC.
The device provides 14,579 logic cells and 589,824 bits of RAM, creating a compact platform for parallel digital signal processing, control logic, protocol bridging, and embedded data acquisition. Its 232 I/Os provide substantial connectivity for parallel buses, clocks, controls, and high-speed interfaces. The listed internal frequency is 667 MHz, while published summaries also identify a 400 MHz operating or processing frequency for this device. External memory interfaces and high-speed transceiver capabilities should therefore be checked against the specific design requirements.
The CSG324 package uses a 0.80 mm ball pitch and measures approximately 19 mm by 19 mm. Its 324-ball construction supports dense routing to FPGA logic and memory resources, but PCB layout must follow AMD package and pinout documentation. Spartan-6 LX devices in the same supported package are pinout compatible, making speed- and temperature-grade alternatives practical when timing or commercial-temperature requirements differ.
Typical uses include industrial automation, test and measurement, automotive infotainment, consumer bridging, communications gateways, and embedded control. The 14,579-cell device is especially appropriate for designs requiring deterministic parallel logic and moderate on-chip RAM without moving to a larger FPGA family. A design must still close timing for the selected speed grade and verify pin-compatible power, configuration, and interface requirements.
Careful power planning is essential because both dynamic and static consumption depend on the selected configuration, clocking, I/O activity, and environmental conditions. Place decoupling capacitors at the relevant power pins, follow the AMD Spartan-6 package pinout files during routing, and validate the final configuration and bitstream against the production PCB.
This page combines package, logic-resource, I/O, memory, and voltage information with speed-grade alternatives, engineering design notes, and application guidance. It provides a practical basis for determining whether the XC6SLX16-3CSG324I fits a design before detailed timing closure and board validation begin.
Pilihan pengganti yang segera untuk XC6SLX16-3CSG324I — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Varietas dalam siri ini
Model serupa yang kompatibel dengan pengganti yang segera XC6SLX16-3CSG324I (sama faktor bentuk dan kaki) — berbeza dalam Package, Device Type, Speed Grade, Lead-Free Status, Operating Temperature.
XC6SLX16-3CSG324C
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →XC6SLX16-2CSG324I
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →XC6SLX16-2CSG324C
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →XC6SLX25-2CSG324I
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →XC6SLX45-L1CSG324I
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
XC6SLX16-3CSG324I Penilaian maksimum & Ciri-ciri Elektrik
| Device Type | FPGA |
| FPGA Family | Spartan-6 LX |
| Manufacturing Technology | 45 nm |
| Logic Cells | 14,579 cells |
| Number of LABs/CLBs | 1,139 LABs/CLBs |
| Total RAM | 589,824 bits |
| Number of I/O | 232 I/Os |
| Internal Frequency | 667 MHz |
| Operating Frequency | 400 MHz |
| Tegangan Pemberi Arus | 1.14 V to 1.26 V |
| Speed Grade | -3 |
| Gambaran Suhu Operasi | -40 °C to 100 °C junction |
| Commercial Ambient Temperature | 0 °C to 85 °C |
| Kemasan | 324-ball CSBGA, 19 mm × 19 mm |
| Ball Pitch | 0.80 mm |
| Jenis Pemasangan | Surface mount |
| Lead-Free Status | Lead free |
Panduan Konfigurasi Pin XC6SLX16-3CSG324I 324-ball csbga, 19 mm × 19 mm
Konfigurasi pin untuk XC6SLX16-3CSG324I (324-ball csbga, 19 mm × 19 mm pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk XC6SLX16-3CSG324I.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
XC6SLX16-3CSG324I patut untuk 6 aplikasis: Industrial Automation Controller, Test and Measurement Front End, Automotive Infotainment Interface, Communications Protocol Bridge, Consumer Signal Conversion, Embedded Data Acquisition System.
Industrial Automation Controller
The XC6SLX16-3CSG324I fits industrial automation controllers that combine parallel machine-control logic with data acquisition and communications. Its 14,579 logic cells can implement sequencing, state machines, interlocks, and protocol interfaces, while 589,824 RAM bits provide local buffering for sensor and actuator data. The 232 I/Os provide connections for field-bus transceivers, discrete sensors, encoders, and machine outputs. Place the FPGA beside interface logic and route short, controlled paths for high-speed clocks and data buses. The industrial -3 grade option is appropriate when the product must operate across demanding temperature conditions or when timing closure benefits from the higher performance grade.
Disebarkan
Test and Measurement Front End
The XC6SLX16-3CSG324I is well suited to FPGA-based test and measurement front ends that acquire multiple digital channels and perform parallel analysis. The 232 I/Os support trigger, capture, status, and synchronization signals, while the 589,824 RAM bits can hold acquisition records and intermediate results. Its 400 MHz listed operating frequency provides a useful basis for parallel datapaths, although the actual sampling rate depends on the selected clock, I/O standards, timing constraints, and implemented logic. Keep acquisition clocks and data buses away from switching power nodes, and use controlled impedance routing for high-speed interfaces. Timing closure should include both fabric paths and the selected I/O timing constraints.
Disebarkan
Automotive Infotainment Interface
The XC6SLX16-3CSG324I can support automotive infotainment interface functions that bridge digital buses, perform protocol conversion, or coordinate audio and display control logic. Its 232 I/Os are useful for parallel control channels and commodity bus interfaces, while configurable logic and RAM allow multiple conversion paths to share one programmable device. The industrial-temperature ordering option and -3 speed grade support designs with broader environmental or timing requirements. Automotive production designs must still evaluate applicable qualification, functional-safety, EMC, and environmental requirements at the complete product level. The FPGA part number alone does not establish AEC-Q100 qualification.
Disebarkan
Communications Protocol Bridge
The XC6SLX16-3CSG324I is appropriate for compact communications bridges that translate between parallel or low-speed serial interfaces and a host processor. Its 14,579 logic cells can accommodate state machines, packet handling, CRC processing, buffers, and clock-domain crossing logic. The 589,824 RAM bits provide storage for packet queues and partial-frame buffering without external memory in many designs. For throughput-sensitive conversions, use dedicated clocking resources and disciplined input/output timing constraints. Leave board-level space for transceiver or level-shifter components when the FPGA I/O standards do not directly match the external link. Validate the selected configuration memory interface and boot sequence against the final system architecture.
Disebarkan
Consumer Signal Conversion
The XC6SLX16-3CSG324I can implement consumer signal-conversion products such as format converters, interface conditioners, and programmable logic adapters. Programmable I/O supports adaptation between multiple digital interfaces, while on-chip RAM can smooth transfers between dissimilar clock domains. The 232 I/Os permit a compact implementation with numerous control and data signals, reducing the need for separate bridge logic. Designers should define complete I/O standards and timing constraints before assigning pins, and validate signal integrity on the assembled PCB. For cost-sensitive consumer products, the -2 commercial variants may be attractive when the lower speed grade satisfies all timing requirements.
Disebarkan
Embedded Data Acquisition System
The XC6SLX16-3CSG324I fits embedded data-acquisition systems that gather parallel sensor data, condition it digitally, and transfer it to a processor or memory subsystem. The 232 I/Os provide connectivity for multiple channels, while the FPGA fabric can execute filtering, scaling, interpolation, or event detection in parallel. Its 589,824 RAM bits can implement sample buffering, although sustained acquisition rates must be checked against bandwidth, memory resources, and external-memory performance. Use the AMD package-device pinout files to assign the dense CSG324 ball grid and maintain the specified power and ground connectivity. Separate sensitive input paths from digital switching activity and validate channel skew at the system level.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk XC6SLX16-3CSG324I — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | XC6SLX16-3CSG324C | XC6SLX16-2CSG324I | XC6SLX16-2CSG324C | XC6SLX25-2CSG324I | XC6SLX45-L1CSG324I |
|---|---|---|---|---|---|---|
| Package | CSBGA-324 | CSBGA-324 - same | CSBGA-324 - same | CSBGA-324 - same | CSBGA-324 - same | CSBGA-324 - same |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -3 | -3 | -2 | -2 | -2 | -1L |
| Temperature Grade | Industrial | Commercial | Industrial | Commercial | Industrial | Industrial |
Penyeberangsung Jelas
- Higher -3 speed grade within the same Spartan-6 LX family (vsXC6SLX16-2CSG324I)
- Industrial-temperature ordering option (vsXC6SLX16-3CSG324C)
- Exact LX16 resource class with 14,579 logic cells and 589,824 RAM bits (vsXC6SLX25-2CSG324I)
- Highest listed speed grade among the pin-compatible options (vsXC6SLX45-L1CSG324I)
Catatan Desain
Decouple each configured power rail at its associated FPGA supply pins and follow the AMD Spartan-6 package pinout files for exact VCC, GND, and configuration-supply connections. Keep high-current return paths short and continuous through the ball grid and PCB planes. Because FPGA power varies with configuration and switching activity, estimate the final design with the actual clocking and I/O assumptions rather than a generic utilization figure.
Route clocks using short, symmetric paths and apply the AMD clocking recommendations for the selected clock-capable pins. Match clock and data traces together where practical, avoid crossing split power-plane boundaries, and maintain continuous reference planes beneath high-speed routes. The 0.80 mm CSG324 ball pitch leaves limited routing escape space, so complete pin assignment and layer planning before the first layout pass.
Do not treat package pin compatibility as proof that a replacement is timing-equivalent. The -2, -1L, and -3 speed grades have different performance envelopes, and commercial-versus-industrial suffixes change environmental limits. After changing to XC6SLX16-2CSG324I, XC6SLX16-2CSG324C, or XC6SLX25-2CSG324I, regenerate the implementation results, rerun timing analysis, and verify configuration compatibility before production release.
Assign I/O standards from the actual board environment rather than copying the nominal supply range to every interface. Apply series termination where the selected I/O standard and edge rate require it, and keep clocks, high-speed data, and sensitive control signals separated from noisy power-return paths. Validate eye diagrams, skew, and overshoot on the assembled board because the dense 0.80 mm package can make assembly variation and return-path discontinuities especially important.
Maklumat Kesediaan
The package is identified as lead free. Current part-specific RoHS, REACH, AEC-Q100, halogen-free, and conflict-minerals declarations should be confirmed through the Request a Quote form.
