XCKU5P-1SFVB784E - 304 I/O Kintex UltraScale+ FPGA | AMD
MPN: XCKU5P-1SFVB784E ✓ AktifXCKU5P-1SFVB784E Ringkasan
A field-programmable gate array is a semiconductor whose digital functions are defined after fabrication by loading a configuration bitstream. An FPGA belongs to the broader programmable-logic hierarchy alongside complex programmable logic devices, while its internal architecture commonly includes programmable logic, block RAM, DSP resources, high-speed I/O, clocking, and configuration interfaces. Kintex UltraScale+ devices balance general-purpose programmable logic with dedicated resources for data processing and high-speed serial connectivity.
The principal feature of the XCKU5P-1SFVB784E is its combination of approximately 216,960 logic blocks and 304 I/O in one 784-ball FCBGA package. Its -1 speed grade provides a distinct operating-performance class within the Kintex UltraScale+ family. The device listing also identifies 304 I/O, making the package especially relevant to designs that cannot be implemented with a smaller or lower-pin-count FPGA. Exact internal RAM, DSP, transceiver, voltage, and performance figures require confirmation in the AMD device documentation before final design release.
For power, clocking, and board planning, the 784-ball package demands careful assignment of power rails and controlled layout around high-speed interfaces. Although the device combines extensive programmable resources, utilization depends on the architecture selected in the AMD Vivado design environment and on the speed, memory, and I/O requirements of the final bitstream. Design reviews should compare the actual resource totals reported by the tool against the device limits.
Typical uses include high-speed data acquisition, network interface control, industrial automation, test equipment, signal processing, protocol bridging, and embedded accelerator systems. The large I/O count can simplify designs that otherwise require several programmable devices, while the high logic-block count supports parallel datapaths and complex control logic. Any replacement assessment must preserve the exact FCBGA footprint, power architecture, configuration behavior, speed grade, and device identifiers.
A critical design consideration is that equivalent-looking FPGA order codes are not automatically interchangeable. Pin compatibility depends on the exact package drawing, while functional compatibility depends on voltage rails, configuration pins, exposed resources, and the selected bitstream target. Review the AMD package pinout and device tables before substituting any part, and reserve at least one complete hardware validation cycle for any proposed alternate device.
This page consolidates the available device identity, package, I/O, and logic-block information with practical FPGA design guidance, sourcing paths, and structured engineering comparisons. It is intended to accelerate initial component selection while keeping final resource, power, timing, and pin-level decisions tied to AMD's authoritative documentation.
Pilihan pengganti yang segera untuk XCKU5P-1SFVB784E — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Tiada pilihan pengganti yang segera untuk produk ini.
Minta AlternatifXCKU5P-1SFVB784E Penilaian maksimum & Ciri-ciri Elektrik
| Manufacturer | AMD |
| Device Type | Kintex UltraScale+ FPGA |
| Programmable Logic Blocks | 216960 blocks |
| User I/O Count | 304 I/O |
| Kemasan | 784-BFBGA / FCBGA |
| Package Pin Count | 784 balls |
| Speed Grade | -1 |
| Product Family | Kintex UltraScale+ |
| Programming Technology | FPGA configuration bitstream |
| Status Lingkungan Hidup | Active |
Panduan Konfigurasi Pin XCKU5P-1SFVB784E 784 balls
Konfigurasi pin untuk XCKU5P-1SFVB784E (784 balls pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk XCKU5P-1SFVB784E.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
XCKU5P-1SFVB784E patut untuk 6 aplikasis: High-Speed Data Acquisition, Industrial Automation and Machine Control, Network Interface Acceleration, Test and Measurement Equipment, Signal Processing and Digital Filtering, Aerospace Communication Payload Processing.
High-Speed Data Acquisition
The XCKU5P-1SFVB784E fits high-speed acquisition systems that require parallel sensors, wide data buses, and extensive on-chip processing. Its approximately 216,960 programmable logic blocks can implement sampling control, digital filtering, correlation, buffering, and data-format conversion in parallel. The 304 user I/O provide substantial connectivity for multichannel analog front ends, clock distribution, trigger signals, and high-speed parallel memory interfaces. Because actual edge rates depend on the selected I/O standard and board-level timing, engineers should use AMD timing tools to close each interface and preserve signal integrity through controlled-length routing, reference planes, and matched clocking.
Disebarkan
Industrial Automation and Machine Control
The XCKU5P-1SFVB784E is well suited to industrial controllers that coordinate motion, sensors, interlocks, communications, and real-time decision logic. Its large programmable logic fabric supports parallel state machines, protocol bridges, timing controls, and supervisory functions without requiring several smaller devices. The 304 user I/O allow direct connection of encoders, discrete inputs, outputs, and field buses. For factory deployment, verify the exact ordering code's temperature rating, voltage requirements, I/O standards, and lifecycle status, then design isolation, surge protection, grounding, and fail-safe behavior at the system level.
Disebarkan
Network Interface Acceleration
The XCKU5P-1SFVB784E can serve as the programmable heart of high-throughput network equipment by combining extensive lookup and packet-processing logic with a high count of external I/O. Designers can implement packet classification, queues, filtering, aggregation, traffic shaping, and custom protocol handling in parallel. Its approximately 216,960 logic blocks allow meaningful headroom for complex control paths and test instrumentation. High-speed serial performance depends on the device's integrated transceiver resources and the selected package, which must be confirmed for the exact ordering code before a PCB is committed.
Disebarkan
Test and Measurement Equipment
The XCKU5P-1SFVB784E fits instrument controllers that must coordinate acquisition channels, timing generators, pattern engines, calibration logic, and external interfaces. The large logic-block count supports parallel test sequences and low-latency decision logic, while 304 user I/O simplify connections to converters, memories, triggers, and communication ports. Timing closure remains dependent on the selected I/O standards, clock topology, and board channel-length matching. A robust design should reserve pins for configuration, boundary scanning, clock management, and debug access exactly as required by the AMD package documentation.
Disebarkan
Signal Processing and Digital Filtering
The XCKU5P-1SFVB784E supports parallel signal-processing designs such as fixed-point filters, FFT-style pipelines, adaptive control, and sensor fusion. Its approximately 216,960 programmable logic blocks allow multiple datapaths to operate concurrently while control logic manages buffering, scaling, and result formatting. The 304 user I/O can support high-throughput parallel data sources and sinks, reducing pressure on serialized links where suitable physical I/O are available. Developers should map operations onto the device's documented DSP, block RAM, and routing resources rather than assuming every operation uses identical logic and memory efficiency.
Disebarkan
Aerospace Communication Payload Processing
The XCKU5P-1SFVB784E can support payload and communication-processing functions where parallel logic, deterministic control, and numerous external connections are important. Programmable modules can implement channelization, framing, coding assistance, packet routing, and telemetry collection, subject to confirmation of the exact device resources and qualification status. The large 784-BFBGA package imposes demanding layout and thermal requirements, so engineers should follow the AMD power and package guidance, validate pin assignments for every board revision, and complete radiation, temperature, and environmental qualification at the complete-system level.
Disebarkan
Data referensi kejuruteraan untuk XCKU5P-1SFVB784E — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini |
|---|---|
| Package | 784-BFBGA / FCBGA |
| Brand | AMD |
| Device Type | Kintex UltraScale+ FPGA |
| Programmable Logic Blocks | 216960 blocks |
| User I/O Count | 304 I/O |
| Speed Grade | -1 |
| Total Package Balls | 784 balls |
| Mounting Type | Surface Mount |
| Lifecycle Status | Active |
Penyeberangsung Jelas
- High user-I/O count in the selected package (vsXCKU5P-2FFVB676I)
- Distinct -1 speed-grade configuration (vsXCKU5P-2FFVB676I)
- Substantial programmable logic for parallel architectures (vsXCKU5P-2FFVD900I)
Catatan Desain
Use the exact AMD power table for SFVB784E to assign VCCINT, VCCAUX, VCCBRAM, VCCO, and any specialized transceiver or auxiliary rails. Do not infer rail equivalence from a nearby XCKU5P ordering code. Decouple each rail at its associated package balls using the manufacturer's recommended capacitor network, preserve the specified supply sequencing, and verify steady-state plus startup current in the complete design.
Treat the 784-ball FCBGA as a high-density escape-routing problem. Follow the AMD package pinout and PCB design guidance for ball assignment, power-plane segmentation, via-in-pad or microvia options, fanout, and thermal-via placement. Match length on clocks and high-speed buses, maintain continuous reference planes, and inspect every layer transition with a signal-integrity model before fabrication.
The FCBGA package requires a deliberate thermal path, but actual power depends on logic utilization, clock rates, memory activity, I/O loading, and ambient conditions. Populate the thermal array according to the package drawing, connect it to the board heat-spreader strategy, and use the AMD power estimator for the implemented design. Perform thermal simulation for both nominal operation and the worst credible utilization case.
Do not treat another XCKU5P code as interchangeable merely because it uses the same device family. The XCKU5P-2FFVB676I and XCKU5P-2FFVD900I have different package footprints from the 784-BFBGA target. Validate the exact ordering code, speed grade, temperature option, pinout, voltage plan, bitstream target, and configuration interface before releasing a PCB or production build.
Maklumat Kesediaan
Compliance status is unknown for this exact ordering code because no product declaration or explicit compliance statement was identified. Confirm the applicable declarations and material documentation before procurement.
