10CL120ZF780I8G - Cyclone 10 LP FPGA, 119K LE, 780-BGA | Intel
MPN: 10CL120ZF780I8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $174.63 | $174.63 |
| 10 | $162.5 | $1,625.00 |
| 100 | $148.75 | $14,875.00 |
| 250 | $140 | $35,000.00 |
| 500 | $132.5 | $66,250.00 |
10CL120ZF780I8G Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic function is defined after manufacturing by the user's configuration bitstream. The Cyclone 10 LP belongs to the FPGA -> programmable logic -> programmable logic IC -> integrated circuit taxonomy, sitting alongside CPLDs in the broader programmable logic hierarchy. Unlike ASICs, FPGAs offer rapid prototyping and field-upgradability, while delivering deterministic parallel processing for DSP, glue logic, and interface bridging tasks.
Key features of the 10CL120ZF780I8G include up to 3,981,312 embedded memory bits distributed across M9K blocks, 525 maximum user I/Os, dedicated DSP blocks for hardware multiplication, and Phase-Locked Loops (PLLs) for clock management. The FineLine BGA-780 package supports high I/O count with controlled-impedance routing suitable for LVDS pairs and external memory interfaces such as DDR3.
The Cyclone 10 LP architecture balances logic density with low static power, enabling fanless or sealed-enclosure deployments in industrial control, video processing, and motor control. Configuration is supported via active serial (AS), passive serial (PS), and JTAG modes, with on-chip encryption and bitstream authentication available through design software configuration.
Typical applications include industrial machine vision, motor drive control, factory automation bridges, video surveillance encoding, and low-power edge aggregation nodes. Engineers select this family when they need >100K logic elements, generous I/O count, and industrial-grade reliability without the cost or power of high-end FPGAs.
A key design consideration: BGA-780 requires multi-layer PCB stackup with microvia or via-in-pad technology. Plan PCB escape routing and matched-length pairs before committing to this package, as BGA rework is impractical outside specialized facilities. Use the Intel Quartus Prime design suite for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, verified drop-in alternatives from the Cyclone 10 LP family, and practical board-level design notes not found in the manufacturer datasheet.
Drop-in alternatives for 10CL120ZF780I8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10CL120ZF780I8G (same form factor and footprint) — differing in Package, Configuration Modes, Logic Elements (LE), Process Technology, Embedded Memory (bits).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CL120YF780I7G
✅ Drop-In✓ In Stock
$102 / Unit
View Datasheet →10CL120YF780C8G
✅ Drop-In✓ In Stock
$122.75 / Unit
View Datasheet →10CL080ZF780I8G
✅ Drop-In✓ In Stock
$71.89 / Unit
View Datasheet →10CL120ZF780I8G Maximum Ratings & Electrical Characteristics
| Series | Cyclone 10 LP |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 119,088 |
| Embedded Memory Bits | 3,981,312 |
| Embedded Memory Type | M9K blocks |
| Maximum User I/Os | 525 |
| Package | 780-ball FBGA (FineLine BGA) |
| Process Technology | 60 nm low-power |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Configuration Modes | AS, PS, JTAG |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10CL120ZF780I8G 780-ball fbga (fineline bga) Pin Configuration Guide
Pin configuration for 10CL120ZF780I8G (780-ball fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL120ZF780I8G.
Refer to the datasheet for full pin configuration.
Typical Applications
10CL120ZF780I8G is suitable for 6 applications: Industrial Machine Vision, Motor Control and Drive, Video Surveillance Encoding, Factory Automation Bridges, Edge Aggregation and Sensor Hubs, Medical Diagnostic Instrumentation.
Industrial Machine Vision
The 10CL120ZF780I8G's 119,088 logic elements and 525 user I/Os make it a strong fit for industrial machine vision pipelines. Its M9K memory blocks buffer pixel data at line rates, while dedicated DSP blocks accelerate convolution, thresholding, and edge-detection operations. The 780-ball FBGA package exposes enough LVDS pairs to ingest multi-channel Camera Link or MIPI CSI-2 streams. Compared with a discrete DSP+MCU architecture, this single-chip approach reduces BOM and latency. Industrial-grade temperature support ensures reliable operation on the factory floor.
Recommended
Motor Control and Drive
The 10CL120ZF780I8G supports multi-axis motor control by integrating encoder decoding, PWM generation, and current-loop compensation in programmable logic. Its 525 I/Os connect to gate drivers, Hall/encoder inputs, and protective circuitry without external muxing. The Cyclone 10 LP architecture delivers deterministic loop times below 1 microsecond, which is critical for field-oriented control of permanent-magnet motors. Industrial temperature grade and robust PLL-based clocking suit harsh drive environments with electrical noise.
Recommended
Video Surveillance Encoding
The 10CL120ZF780I8G encodes H.264 or MJPEG streams from one or more camera inputs at D1/720p resolutions. Its 3,981,312 bits of embedded memory act as line buffers and reference-frame caches, while the abundant logic elements implement motion-estimation and entropy-coding engines. The 780-ball FBGA footprint supports the high I/O count needed for parallel video buses and DDR3 frame buffers. Low static power reduces thermal load in sealed outdoor camera enclosures.
Recommended
Factory Automation Bridges
In factory automation, the 10CL120ZF780I8G bridges legacy fieldbuses (Profibus, RS-485, CAN) to Ethernet/IP or PROFINET. Its 525 I/Os and flexible SERDES resources handle multiple protocol stacks concurrently. The device's low static power enables fanless DIN-rail mounting, while industrial temperature rating tolerates cabinet environments up to +100C. Quartus Prime simplifies migration between factory protocols via IP cores, shortening time-to-market for bridge designs.
Recommended
Edge Aggregation and Sensor Hubs
The 10CL120ZF780I8G aggregates data from distributed sensors (temperature, vibration, pressure) in industrial IoT edge nodes. Its logic elements implement lightweight filtering and threshold detection, while PLLs synchronize multi-rate sampling. Embedded M9K memory buffers time-series data before forwarding over Ethernet or wireless links. The 780-ball FBGA package gives designers headroom for future sensor expansion without migrating silicon.
Recommended
Medical Diagnostic Instrumentation
The 10CL120ZF780I8G supports mid-range medical instrumentation such as ultrasound front-end preprocessing, patient-monitoring aggregators, and laboratory analyzers. Its DSP blocks accelerate FIR/FFT operations, while abundant I/Os interface analog front-ends, displays, and isolated communication links. The deterministic latency of FPGA logic helps meet IEC 62304-style software-of-unknown-provenance requirements by delegating safety-critical loops to hardware. Designers should validate additional compliance per end-system standards.
Recommended
Recommended Products Summary
Engineering reference data for 10CL120ZF780I8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL120YF780I7G | 10CL120YF780C8G | 10CL080ZF780I8G |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 780-ball FBGA | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same |
| Speed Grade | Z (slowest) | Y (faster than Z) | Y | Z |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
Key Differentiators
- Higher logic density at industrial speed grade (vs 10CL080ZF780I8G)
- Industrial temperature in Z speed grade (vs 10CL120YF780C8G)
- Abundant I/O count for interface-rich designs (vs 10CL120ZF484I8G)
Design Notes
The 780-ball FineLine BGA requires HDI PCB fabrication with laser-drilled microvias and via-in-pad for inner-row escape. Plan a 6-8 layer stackup with continuous ground planes adjacent to signal layers for controlled impedance. Allocate at least two layers for high-speed signals (LVDS, DDR3) and verify breakout routing in the Quartus Prime pin-planner before tape-out.
Estimated: At typical industrial utilization (~30% LE toggle rate, 50% memory usage), the 10CL120ZF780I8G dissipates approximately 1.5-2.5W. With a FineLine BGA thermal resistance of approximately 15 C/W (theta_JB), junction rise above case is 25-40C. Provide a thermal pad or copper heat-spreader on the top side for sealed-enclosure deployments.
Do not assume Cyclone 10 LP FPGAs with the same package but different suffixes (Z vs Y speed grade, I vs C temperature grade) are timing-identical. Always re-run Quartus Prime timing analysis after substituting. Also verify configuration mode (AS, PS, JTAG) pin mapping matches your board - mis-wired configuration pins are a top cause of FPGA bring-up failures.
Compliance Information
RoHS and REACH compliant per Intel product specifications. AEC-Q100 not applicable - this is a logic device, not an automotive-grade IC. Conflict-minerals declaration available from Intel corporate compliance.