10CL120ZF780I8G - Cyclone 10 LP FPGA, 119K LE, 780-BGA | Intel
부품 번호: 10CL120ZF780I8G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $174.63 | $174.63 |
| 10 | $162.5 | $1,625.00 |
| 100 | $148.75 | $14,875.00 |
| 250 | $140 | $35,000.00 |
| 500 | $132.5 | $66,250.00 |
10CL120ZF780I8G 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic function is defined after manufacturing by the user's configuration bitstream. The Cyclone 10 LP belongs to the FPGA -> programmable logic -> programmable logic IC -> integrated circuit taxonomy, sitting alongside CPLDs in the broader programmable logic hierarchy. Unlike ASICs, FPGAs offer rapid prototyping and field-upgradability, while delivering deterministic parallel processing for DSP, glue logic, and interface bridging tasks.
Key features of the 10CL120ZF780I8G include up to 3,981,312 embedded memory bits distributed across M9K blocks, 525 maximum user I/Os, dedicated DSP blocks for hardware multiplication, and Phase-Locked Loops (PLLs) for clock management. The FineLine BGA-780 package supports high I/O count with controlled-impedance routing suitable for LVDS pairs and external memory interfaces such as DDR3.
The Cyclone 10 LP architecture balances logic density with low static power, enabling fanless or sealed-enclosure deployments in industrial control, video processing, and motor control. Configuration is supported via active serial (AS), passive serial (PS), and JTAG modes, with on-chip encryption and bitstream authentication available through design software configuration.
Typical applications include industrial machine vision, motor drive control, factory automation bridges, video surveillance encoding, and low-power edge aggregation nodes. Engineers select this family when they need >100K logic elements, generous I/O count, and industrial-grade reliability without the cost or power of high-end FPGAs.
A key design consideration: BGA-780 requires multi-layer PCB stackup with microvia or via-in-pad technology. Plan PCB escape routing and matched-length pairs before committing to this package, as BGA rework is impractical outside specialized facilities. Use the Intel Quartus Prime design suite for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, verified drop-in alternatives from the Cyclone 10 LP family, and practical board-level design notes not found in the manufacturer datasheet.
드롭인 대체품: 10CL120ZF780I8G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10CL120ZF780I8G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration Modes, Logic Elements (LE), Process Technology, Embedded Memory (bits).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10CL120YF780I7G
✅ 드롭인✓ 재고 있음
$102 / 개
데이터시트 보기 →10CL120YF780C8G
✅ 드롭인✓ 재고 있음
$122.75 / 개
데이터시트 보기 →10CL080ZF780I8G
✅ 드롭인✓ 재고 있음
$71.89 / 개
데이터시트 보기 →10CL120ZF780I8G 최대 정격 & 전기적 특성
| Series | Cyclone 10 LP |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 119,088 |
| Embedded Memory Bits | 3,981,312 |
| Embedded Memory Type | M9K blocks |
| Maximum User I/Os | 525 |
| 패키지 | 780-ball FBGA (FineLine BGA) |
| Process Technology | 60 nm low-power |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Configuration Modes | AS, PS, JTAG |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
10CL120ZF780I8G 780-ball fbga (fineline bga) 핀 구성 가이드
10CL120ZF780I8G(780-ball fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10CL120ZF780I8G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10CL120ZF780I8G 적합 용도: 6 애플리케이션s: Industrial Machine Vision, Motor Control and Drive, Video Surveillance Encoding, Factory Automation Bridges, Edge Aggregation and Sensor Hubs, Medical Diagnostic Instrumentation.
Industrial Machine Vision
The 10CL120ZF780I8G's 119,088 logic elements and 525 user I/Os make it a strong fit for industrial machine vision pipelines. Its M9K memory blocks buffer pixel data at line rates, while dedicated DSP blocks accelerate convolution, thresholding, and edge-detection operations. The 780-ball FBGA package exposes enough LVDS pairs to ingest multi-channel Camera Link or MIPI CSI-2 streams. Compared with a discrete DSP+MCU architecture, this single-chip approach reduces BOM and latency. Industrial-grade temperature support ensures reliable operation on the factory floor.
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Motor Control and Drive
The 10CL120ZF780I8G supports multi-axis motor control by integrating encoder decoding, PWM generation, and current-loop compensation in programmable logic. Its 525 I/Os connect to gate drivers, Hall/encoder inputs, and protective circuitry without external muxing. The Cyclone 10 LP architecture delivers deterministic loop times below 1 microsecond, which is critical for field-oriented control of permanent-magnet motors. Industrial temperature grade and robust PLL-based clocking suit harsh drive environments with electrical noise.
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Video Surveillance Encoding
The 10CL120ZF780I8G encodes H.264 or MJPEG streams from one or more camera inputs at D1/720p resolutions. Its 3,981,312 bits of embedded memory act as line buffers and reference-frame caches, while the abundant logic elements implement motion-estimation and entropy-coding engines. The 780-ball FBGA footprint supports the high I/O count needed for parallel video buses and DDR3 frame buffers. Low static power reduces thermal load in sealed outdoor camera enclosures.
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Factory Automation Bridges
In factory automation, the 10CL120ZF780I8G bridges legacy fieldbuses (Profibus, RS-485, CAN) to Ethernet/IP or PROFINET. Its 525 I/Os and flexible SERDES resources handle multiple protocol stacks concurrently. The device's low static power enables fanless DIN-rail mounting, while industrial temperature rating tolerates cabinet environments up to +100C. Quartus Prime simplifies migration between factory protocols via IP cores, shortening time-to-market for bridge designs.
추천
Edge Aggregation and Sensor Hubs
The 10CL120ZF780I8G aggregates data from distributed sensors (temperature, vibration, pressure) in industrial IoT edge nodes. Its logic elements implement lightweight filtering and threshold detection, while PLLs synchronize multi-rate sampling. Embedded M9K memory buffers time-series data before forwarding over Ethernet or wireless links. The 780-ball FBGA package gives designers headroom for future sensor expansion without migrating silicon.
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Medical Diagnostic Instrumentation
The 10CL120ZF780I8G supports mid-range medical instrumentation such as ultrasound front-end preprocessing, patient-monitoring aggregators, and laboratory analyzers. Its DSP blocks accelerate FIR/FFT operations, while abundant I/Os interface analog front-ends, displays, and isolated communication links. The deterministic latency of FPGA logic helps meet IEC 62304-style software-of-unknown-provenance requirements by delegating safety-critical loops to hardware. Designers should validate additional compliance per end-system standards.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10CL120ZF780I8G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10CL120YF780I7G | 10CL120YF780C8G | 10CL080ZF780I8G |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 780-ball FBGA | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same |
| Speed Grade | Z (slowest) | Y (faster than Z) | Y | Z |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
주요 차별점
- Higher logic density at industrial speed grade (vs 10CL080ZF780I8G)
- Industrial temperature in Z speed grade (vs 10CL120YF780C8G)
- Abundant I/O count for interface-rich designs (vs 10CL120ZF484I8G)
설계 노트
The 780-ball FineLine BGA requires HDI PCB fabrication with laser-drilled microvias and via-in-pad for inner-row escape. Plan a 6-8 layer stackup with continuous ground planes adjacent to signal layers for controlled impedance. Allocate at least two layers for high-speed signals (LVDS, DDR3) and verify breakout routing in the Quartus Prime pin-planner before tape-out.
Estimated: At typical industrial utilization (~30% LE toggle rate, 50% memory usage), the 10CL120ZF780I8G dissipates approximately 1.5-2.5W. With a FineLine BGA thermal resistance of approximately 15 C/W (theta_JB), junction rise above case is 25-40C. Provide a thermal pad or copper heat-spreader on the top side for sealed-enclosure deployments.
Do not assume Cyclone 10 LP FPGAs with the same package but different suffixes (Z vs Y speed grade, I vs C temperature grade) are timing-identical. Always re-run Quartus Prime timing analysis after substituting. Also verify configuration mode (AS, PS, JTAG) pin mapping matches your board - mis-wired configuration pins are a top cause of FPGA bring-up failures.
규정 준수 정보
RoHS and REACH compliant per Intel product specifications. AEC-Q100 not applicable - this is a logic device, not an automotive-grade IC. Conflict-minerals declaration available from Intel corporate compliance.