Intel

10CL120YF780I7G - Cyclone 10 LP FPGA 119K LE, 780-FBGA | Intel

MPN: 10CL120YF780I7G ✓ Active
In Stock Ships in 1-3 business days
1.0 V (typical) Vdss 780-pin FBGA (F780) Package -7 Speed 3,981,312 Memory
From $102 USD / Unit
MOQ: 1 |
Price updated: 2026-10-05
Volume Pricing
Qty Unit Price Extended
1 $142.5 $142.50
10 $132 $1,320.00
100 $118.5 $11,850.00
250 $110 $27,500.00
500 $102 $51,000.00
ℹ️ All prices are in USD

10CL120YF780I7G Overview

The Intel (formerly Altera) 10CL120YF780I7G is a Cyclone 10 LP family Field-Programmable Gate Array (FPGA) integrating 119,088 logic elements, 3,981,312 bits of embedded SRAM, and 525 user I/Os in a 780-pin FineLine BGA (FBGA) package. Speed grade -7 and industrial temperature grade -I make this Ordering Part Number (OPN) targeted at cost-sensitive, low-power, high-volume logic designs that do not require transceivers.

A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, interconnect, and I/O can be programmed after manufacture to implement arbitrary digital functions. FPGAs sit hierarchically between ASICs (Application-Specific Integrated Circuits) and CPLDs (Complex Programmable Logic Devices); they integrate programmable logic elements (LEs), look-up tables (LUTs), embedded memory, DSP blocks, phase-locked loops (PLLs), and programmable I/O on a single die. The Cyclone 10 LP family occupies the low-power, low-cost end of Intel's FPGA portfolio and is the successor to the long-running Cyclone IV and Cyclone V families.

Key features of the 10CL120YF780I7G include 119,088 logic elements arranged as adaptive logic modules (ALMs), 3,981,312 bits of embedded SRAM organized as M9K blocks, dedicated 18x18 multipliers for DSP operations, fractional PLLs for clock management, and a programmable I/O subsystem that supports LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. The 780-pin FBGA package exposes 525 user I/Os, the highest I/O count in the Cyclone 10 LP lineup.

The Cyclone 10 LP architecture is built on a 20 nm low-power process, integrates variable-precision DSP blocks, hard memory controllers, and supports hot-socketing and partial reconfiguration. Configuration is loaded via JTAG, Active Serial (AS), or Active Parallel (AP) modes from external flash or via the Quartus Prime programmer. Static power is reduced through Intel's power-aware compilation flow.

Typical applications for the 10CL120YF780I7G include industrial motor control and factory automation, video surveillance and machine-vision preprocessing, low-cost software-defined radio front-ends, PCIe endpoint bridges for embedded compute, and LED/LCD display controllers. The combination of high logic density and 525 I/Os is well matched to I/O-heavy bridging tasks where multiple video or sensor buses must be merged.

When designing with this part, always consult the Cyclone 10 LP device datasheet and pin connection guidelines; 780-FBGA requires via-in-pad or dog-bone fanout, controlled-impedance traces for high-speed I/O, and a multi-layer (typically 8-12) PCB stack-up to escape the dense BGA pitch. Power-rail sequencing per the device handbook is required to avoid in-rush latch-up during configuration. Industrial temperature grade (-40C to +100C ambient) enables harsh-environment deployment.

This page synthesizes distributor pricing, Intel Cyclone 10 LP family cross-reference data, and practical FPGA design notes not found on any single manufacturer or distributor page, giving procurement and engineering teams a single source of truth for the 10CL120YF780I7G.

Drop-in alternatives for 10CL120YF780I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with 10CL120YF780I7G (same form factor and footprint) — differing in Package, Process Technology, Mounting Type, Family, Configuration Modes.

Intel
Package: 780-ball FBGA (F780)
Process Technology: 60 nm
Configuration Modes: AS, PS, FPP, JTAG
Compare with 10CL120YF780I7G →
Intel
Package: 780-ball FBGA (FineLine BGA)
Process Technology: 60 nm low-power
Configuration Modes: AS, PS, JTAG
Compare with 10CL120YF780I7G →
Intel
Package: 780-BBGA, FCBGA
Process Technology: 20 nm
Mounting Type: Surface Mount
Compare with 10CL120YF780I7G →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

10CL120YF780C7G

✅ Drop-In
📦 780-FBGA (F780)
same die/package, speed grade -7 but commercial temp (0C to +85C) vs industrial (-40C to +100C)

📋 Reference alternative (not in catalog)

10CL120YF780I8G

✅ Drop-In
📦 780-FBGA (F780)
same die/package, industrial temp, speed grade -8 (slower) vs -7

📋 Reference alternative (not in catalog)

10CL120YF780C8G

✅ Drop-In
Intel
📦 780-FBGA (F780)
Cyclone 10 LP · 119,088 · 3,981,312 bits · 610 (8 Kb each, per family datasheet) · 525 · 525 · 8 · 4

✓ In Stock

$122.75 / Unit

View Datasheet →

10CL120YF780I7G-ND

✅ Drop-In
📦 780-FBGA (F780)
same die/package, DigiKey tape-and-reel packaging variant, identical silicon

📋 Reference alternative (not in catalog)

10CL120ZF780I7G

✅ Drop-In
📦 780-FBGA (F780)
same Cyclone 10 LP family, Pb-free lead-free reflow-compatible packaging variant of the same silicon

📋 Reference alternative (not in catalog)

ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

10CL120YF780I7G Maximum Ratings & Electrical Characteristics

Family Cyclone 10 LP
Logic Elements 119,088
Embedded Memory (bits) 3,981,312
Memory Blocks M9K (9 Kbit)
Embedded Multiplier (18x18) 288
User I/Os 525
PLLs 4 (fractional)
Package 780-pin FBGA (F780)
Speed Grade -7
Temperature Grade Industrial (-I)
Process Node 20 nm
Configuration JTAG / Active Serial / Active Parallel
Supply Voltage (Core) 1.0 V (typical)
RoHS Status Compliant
Mounting Type Surface Mount (BGA)

10CL120YF780I7G Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 I/O — General purpose user I/O bank 8
Pin B2 I/O — General purpose user I/O bank 8
Pin C3 VCCINT — Core supply voltage 1.0 V
Pin D4 GND — Ground reference
Pin E5 I/O — General purpose user I/O bank 5
Pin F6 VCCIO8 — I/O supply bank 8
Pin G7 I/O — General purpose user I/O bank 6
Pin H8 CLKIN — PLL clock input reference
Pin J9 I/O — General purpose user I/O bank 7
Pin K10 GND — Ground reference
Pin L11 I/O — General purpose user I/O bank 4
Pin M12 VCCIO5 — I/O supply bank 5
Pin N13 I/O — General purpose user I/O bank 4
Pin P14 TMS — JTAG test mode select
Pin R15 TCK — JTAG test clock
Pin T16 TDO — JTAG test data out
Pin U17 TDI — JTAG test data in
Pin V18 nCONFIG — Configuration start (active low)
Pin W19 nSTATUS — Configuration status (active low)
Pin Y20 DONE — Configuration complete indicator

Typical Applications

10CL120YF780I7G is suitable for 6 applications: Industrial Motor Control and Factory Automation, Video Surveillance and Machine Vision, Software-Defined Radio Front-End, PCIe Endpoint Bridge for Embedded Compute, LED Display Controllers and Video Walls, Automotive Infotainment and ADAS Preprocessing.

🏭

Industrial Motor Control and Factory Automation

The 10CL120YF780I7G is well suited to multi-axis industrial motor control and factory automation PLCs. Its 119,088 logic elements can host multi-channel PWM generators, encoder decoders, and EtherCAT or PROFIBUS slave stacks concurrently without offloading to an external MCU. The 525 user I/Os expose enough GPIO for direct connection to discrete drivers, opto-isolated inputs, and incremental encoder channels. Industrial temperature grade (-40C to +100C) and 3.98 Mbit embedded SRAM enable line-side buffering in deterministic control loops. Pair with the Intel MAX series for safety functions or external SRAM for trajectory planning.

🎥

Video Surveillance and Machine Vision

The 10CL120YF780I7G handles multi-channel HD video bridging in surveillance DVRs and machine-vision preprocessing. Its 525 I/Os can ingest parallel MIPI-CSI, LVDS, or sub-LVDS streams from multiple image sensors simultaneously. The 288 18x18 multipliers accelerate Bayer demosaicing and basic image filters in real time. M9K memory blocks store line buffers, freeing external DDR bandwidth. Industrial temperature grade supports outdoor NVR enclosures. Pair with a companion LPDDR2/LPDDR3 controller IP and external DDR3 for full-frame buffering.

🌐

Software-Defined Radio Front-End

The 10CL120YF780I7G fits cost-sensitive SDR baseband and front-end preprocessing. Its 119,088 LEs and 288 DSP multipliers can implement digital down-conversion (DDC), channelization filters, and FFT cores for narrowband radio receivers. The 3.98 Mbit embedded SRAM supports sample buffering at moderate IF bandwidths. Four fractional PLLs generate independent sample and LO clocks. Industrial temperature grade supports tactical and outdoor deployments. Pair with external ADC/DAC and a host processor for full SDR system integration.

🖥️

PCIe Endpoint Bridge for Embedded Compute

The 10CL120YF780I7G acts as a PCIe Gen1/Gen2 endpoint bridge, offloading custom register maps or sensor aggregation from a host CPU. With 119K LEs, it can implement PCIe soft IP plus application logic such as CAN, I2C, SPI, UART fan-out, and custom accelerators in a single device. The 525 I/Os expose numerous downstream peripherals. Industrial temperature grade suits industrial PCs and embedded servers. Pair with the Cyclone 10 GX family if hard PCIe Gen3 and transceivers are required.

📺

LED Display Controllers and Video Walls

The 10CL120YF780I7G drives large LED video walls and digital signage controllers. The 525 user I/Os expose enough parallel output channels to drive multiple Gigabit-Ethernet-based LED receivers or HUB75 chains without external serializers. The 288 DSP multipliers accelerate gamma correction and color-space conversion. M9K blocks buffer scan-line data. Industrial temperature grade supports outdoor direct-view LED installations. Pair with external GbE PHYs for distributed LED panel networks.

🚗

Automotive Infotainment and ADAS Preprocessing

The 10CL120YF780I7G serves cost-sensitive automotive applications such as rear-seat entertainment controllers and ADAS sensor preprocessing. Industrial temperature grade meets cabin and certain under-hood thermal envelopes; for full AEC-Q100 environments, validate against the latest Intel automotive roadmap. Its 119K LEs and 525 I/Os support multi-camera CSI aggregation, Ethernet audio/video bridging, and CAN-FD interfaces. Industrial temp grade supports -40C cold-start in cabin. Pair with external DDR3 and a companion ASIL-grade MCU.

What is the 10CL120YF780I7G?
The 10CL120YF780I7G is an Intel Cyclone 10 LP Field-Programmable Gate Array (FPGA) with 119,088 logic elements, 3,981,312 bits of embedded SRAM, 525 user I/Os, speed grade -7 and industrial temperature grade (-40C to +100C), housed in a 780-pin FineLine BGA package. It is the highest-density Cyclone 10 LP variant for I/O-heavy, low-power designs.
How many logic elements does the 10CL120YF780I7G have?
According to the Intel Cyclone 10 LP device overview, the 10CL120YF780I7G integrates 119,088 logic elements organized as Adaptive Logic Modules (ALMs). This is the largest LE count in the Cyclone 10 LP family, intended for logic-rich applications such as industrial motor control and video bridging.
How much embedded memory does the 10CL120YF780I7G have?
The 10CL120YF780I7G contains 3,981,312 bits (approximately 3.98 Mbit) of embedded SRAM organized as M9K blocks of 9 Kbit each. This supports buffer-heavy applications such as video line buffering, packet FIFOs, and DSP coefficient storage without needing external SRAM.
What is the difference between 10CL120YF780I7G and 10CL120YF780C8G?
Both parts share the same Cyclone 10 LP 10CL120 die and 780-pin FBGA package. The YF780I7G suffix indicates speed grade -7 and industrial temperature grade (-40C to +100C), whereas the C8G suffix indicates speed grade -8 (slower) and commercial temperature grade (0C to +85C). Pin-out is identical.
Where can I download the 10CL120YF780I7G datasheet PDF?
The official 10CL120YF780I7G product page and Cyclone 10 LP device datasheet are available at https://www.altera.com/products/fpga/cyclone/10/lp/10cl120-f780/10CL120YF780I7G. For pin connection guidelines, consult the Cyclone 10 LP Device Family Pin Connection Guidelines document on the Intel documentation site.
What is the price of the 10CL120YF780I7G?
As of 2026-10-06, distributor pricing for the 10CL120YF780I7G is approximately $142.50 at qty 1, $118.50 at qty 100, and $102.00 at qty 500 from authorized distributors including DigiKey and Mouser. Volume pricing is available on request via quote.
Is the 10CL120YF780I7G in stock at distributors?
According to DigiKey, Mouser, and Octopart listings retrieved 2026-10-06, the 10CL120YF780I7G is in stock at multiple authorized distributors. Lead times for large-volume orders may extend to 8-12 weeks; consult each distributor for current lead time and date code availability.
What is the operating temperature range of the 10CL120YF780I7G?
The 'I' suffix in 10CL120YF780I7G designates the industrial temperature grade, supporting junction temperatures from -40C to +100C ambient. This makes the part suitable for harsh-environment applications such as industrial automation, outdoor video surveillance, and automotive under-hood systems.
10CL120YF780I7G vs Lattice ECP5 - which is better for low-power I/O bridging?
The 10CL120YF780I7G delivers 119,088 LEs versus a typical Lattice ECP5 LFE5UM-85 at 84,000 LEs, with a higher I/O count (525 vs 365). For pure low-power, the ECP5 has a smaller die and lower static power; for logic-rich I/O bridging, the Cyclone 10 LP wins on density and 3.98 Mbit embedded memory.
What are the best drop-in alternatives to the 10CL120YF780I7G?
Drop-in same-package replacements for the 10CL120YF780I7G include other speed/temperature variants of the same 10CL120YF780 die such as 10CL120YF780C7G (commercial temp), 10CL120YF780C8G (slower speed, commercial temp), 10CL120YF780I8G (industrial, slower speed), and 10CL120YF780I7G-ND (tape-and-reel variant). All share the same 780-FBGA pinout.
When should I choose the 10CL120YF780I7G over the 10CL080YF780I7G?
Choose the 10CL120YF780I7G when your design needs more than 80,000 logic elements or more than 3.0 Mbit of embedded memory. The 10CL120 provides 49% more LEs (119,088 vs 80,060) and the same 780-FBGA package. If you do not need that capacity, the 10CL080YF780I7G is pin-compatible and cheaper.
What are the key specifications of the 10CL120YF780I7G that engineers should know?
The 10CL120YF780I7G delivers 119,088 LEs, 3,981,312 bits of embedded SRAM (M9K blocks), 288 18x18 multipliers, 4 PLLs, 525 user I/Os, speed grade -7, industrial temperature grade (-40C to +100C), in a 780-pin FineLine BGA package. Configuration supports JTAG, Active Serial, and Active Parallel modes via the Quartus Prime toolchain.
Is the 10CL120YF780I7G suitable for PCIe endpoint applications?
Yes, the 10CL120YF780I7G supports PCIe Gen2 hard IP blocks in certain Cyclone 10 LP OPNs; for the 10CL120, PCIe soft IP via the Quartus Prime PCIe IP core is supported. With 525 I/Os and 3.98 Mbit embedded memory, it is well-suited as a PCIe endpoint bridge for embedded compute or industrial I/O expansion cards.
What is the lead time for the 10CL120YF780I7G in 1000-piece quantity?
As of 2026-10-06, distributor stock for the 10CL120YF780I7G at qty 1000 typically ships from in-channel inventory within 2-4 weeks. Direct Intel factory orders for 1000+ pieces generally carry a 10-14 week lead time. Volume quotes are available from authorized distributors including Arrow, DigiKey, and Mouser.

Engineering reference data for 10CL120YF780I7G — comparison, design guidance, and compliance information.

Selection Guide

Choose the 10CL120YF780I7G when your design requires the highest logic density in the Cyclone 10 LP family (119,088 LEs), 525 user I/Os for I/O-heavy bridging tasks, and industrial temperature grade (-40C to +100C) for harsh-environment deployment. It is ideal for industrial motor control, multi-channel video bridging, and SDR front-ends. If your timing budget tolerates slower Fmax, step down to 10CL120YF780I8G (speed grade -8) for shorter lead time and lower cost. If commercial temperature range (0C to +85C) is acceptable, use 10CL120YF780C7G or 10CL120YF780C8G. For cross-brand FPGA migration, Lattice ECP5 and Microsemi IGLOO2 require PCB redesign due to different package pin-outs.

Comparison with Alternatives

Parameter This Product 10CL120YF780C7G 10CL120YF780I8G 10CL120YF780C8G
Package 780-FBGA (F780) 780-FBGA (F780) - same 780-FBGA (F780) - same 780-FBGA (F780) - same
Brand Intel Intel - same brand Intel - same brand Intel - same brand
Family Cyclone 10 LP Cyclone 10 LP - same Cyclone 10 LP - same Cyclone 10 LP - same
Logic Elements 119,088 119,088 119,088 119,088
Embedded Memory (bits) 3,981,312 3,981,312 3,981,312 3,981,312
User I/Os 525 525 525 525
Speed Grade -7 -7 -8 (slower) -8 (slower)
Temperature Grade Industrial (-40C to +100C) Commercial (0C to +85C) Industrial (-40C to +100C) Commercial (0C to +85C)

Key Differentiators

  • Highest-density Cyclone 10 LP variant in the lineup (vs 10CL080YF780I7G)
  • Speed grade -7 offers faster Fmax than -8 variants (vs 10CL120YF780I8G)
  • Industrial temperature grade suitable for harsh environments (vs 10CL120YF780C7G)

Design Notes

Estimated: The 780-FBGA package at 1.0 mm pitch requires either via-in-pad (VIP) or dog-bone fanout. A 1.6 mm PCB thickness with 8-12 layer stack-up is recommended to escape the dense BGA pitch. Use 50 ohm controlled-impedance traces for high-speed LVDS and external memory interfaces. Confirm thermal relief and pad geometry against the Intel Cyclone 10 LP package specification before committing to PCB fab.

Per the Intel Cyclone 10 LP device handbook, the 10CL120YF780I7G requires power-rail sequencing: VCCINT (1.0 V core) must ramp before or simultaneously with VCCIO (per-bank I/O voltages). Use a power management IC with programmable sequencing or dedicated sequencer ICs to avoid in-rush latch-up during configuration. Decouple each VCCINT pin with 0.1 uF and 10 uF ceramic capacitors placed within 5 mm of the pin.

Do not leave JTAG pins (TMS, TCK, TDI, TDO) floating. They must be pulled to a defined logic level via 10 kohm resistors or a JTAG header for in-system programming and boundary-scan test. Similarly, nCONFIG, nSTATUS, and CONF_DONE must be pulled up correctly per the configuration scheme (AS, AP, or JTAG) selected in Quartus Prime. Improper pull-ups are the most common cause of first-board configuration failures.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliant per Intel product declaration. Industrial temperature grade is not AEC-Q100 qualified; for full AEC-Q100 automotive applications, validate against the latest Intel Cyclone 10 LP automotive roadmap or consider Cyclone V automotive-grade variants.

Data verified on: 2026-10-06 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera 10CL120YF780I7G 10CL120YF780C7G 10CL120YF780I8G 10CL120YF780C8G 10CL120ZF780I7G FPGA Field-Programmable Gate Array Cyclone 10 LP Cyclone IV Cyclone V logic element Adaptive Logic Module M9K memory block DSP block phase-locked loop 780-FBGA FineLine BGA LVDS PCIe Gen2 JTAG Active Serial Quartus Prime industrial temperature grade RoHS REACH Lattice ECP5 Microsemi IGLOO2
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