10M40DAF256C8G - MAX 10 FPGA 40K LE, 256-FBGA | Intel / Altera
MPN: 10M40DAF256C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $82.2 | $82.20 |
| 10 | $76.4 | $764.00 |
| 100 | $68.9 | $6,890.00 |
| 500 | $61.5 | $30,750.00 |
| 1,000 | $55.2 | $55,200.00 |
Drop-in alternatives for 10M40DAF256C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10M40DAF256C7G
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$46.83 / Unit
View Datasheet →10M50DAF256C8G
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$47.85 / Unit
View Datasheet →10M25DAF256C8G
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$45.3 / Unit
View Datasheet →10M40DAF256A7G
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10M40DAF256I7G
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$65.8 / Unit
View Datasheet →10M50DAF256C7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M40DAF256C8G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements | 40,000 |
| Embedded Memory (Bits) | 1,290,240 |
| Maximum User I/O | 178 |
| Maximum User I/O Pins | 178 |
| Package | 256-FBGA (FineLine BGA) |
| Package Type | 256-LBGA (FBGA-256, 17 x 17 mm, 1.0 mm pitch) |
| Process Technology | 55 nm CMOS |
| Core Voltage | 1.2 V |
| Non-Volatile Configuration | Yes (on-chip flash, instant-on) |
| ADC Blocks | Dual 12-bit sigma-delta ADC (up to 16 analog channels) |
| DSP Blocks | Yes (variable-precision DSP) |
| Embedded User Flash | Yes |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | MSL-3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Design Tool | Intel Quartus Prime |
10M40DAF256C8G 256-lbga (fbga-256, 17 x 17 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for 10M40DAF256C8G (256-lbga (fbga-256, 17 x 17 mm, 1.0 mm pitch) package) with 178 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M40DAF256C8G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 178 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M40DAF256C8G is suitable for 6 applications: Industrial Motor Control and FOC, IoT Edge Gateways and Sensor Aggregation, Video Bridge and Display Controllers, Automotive Driver-Assistance (Non-Safety) Subsystems, Portable Test and Measurement Instrumentation, Industrial Protocol Bridging and PLC I/O.
Industrial Motor Control and FOC
The 10M40DAF256C8G fits industrial motor-control and Field-Oriented Control (FOC) subsystems because its 40K logic elements provide ample headroom for current-loop state machines, while the integrated dual 12-bit ADC samples phase currents and DC-bus voltage with 1 MSPS throughput per the Intel MAX 10 analog features datasheet. Embedded DSP blocks execute Park/Clarke transforms and SVPWM modulation at switching frequencies above 20 kHz with deterministic latency. The on-chip flash enables instant-on configuration, critical for IEC 61508 SIL-2 functional-safety architectures that require deterministic co-processor boot. Place the FBGA-256 near the gate-driver stage to minimize analog routing; the 178 user I/O provide ample pins for encoder, Hall-sensor, and communication interfaces.
Recommended
IoT Edge Gateways and Sensor Aggregation
The 10M40DAF256C8G is well-suited for IoT edge gateways aggregating multiple sensor streams because its 1,290,240 bits of embedded SRAM buffer high-rate sensor data while the non-volatile configuration eliminates external boot memory, reducing BOM count. The integrated ADC reads up to 16 analog channels for environmental telemetry per Intel MAX 10 datasheet. With Quartus Prime support for soft-core Nios II processors, designers implement protocol stacks (Modbus, CAN, MQTT) in firmware on the same chip. The 178 user I/O accommodate SPI, I2C, UART, and GPIO expansion for multi-sensor aggregation. Choose this part over smaller 10M08 when the design needs both local pre-processing and deterministic boot.
Recommended
Video Bridge and Display Controllers
The 10M40DAF256C8G serves as a video bridge between image sensors and LVDS/MIPI/RGB displays because its 40K logic elements implement pixel-clock FIFOs, chroma conversion, and timing generators in a single device. The 1,290,240 bits of embedded SRAM line-buffer the data, while 178 user I/O expose 4 LVDS pairs plus parallel RGB888 according to the MAX 10 device pin-out. Designers leverage Quartus Prime IP cores for I2C-controlled display initialization and backlight PWM. The 256-FBGA package provides clean impedance-controlled routing for high-speed video pairs. Use this part instead of an ASSP when the video pipeline must be customized for non-standard resolutions.
Recommended
Automotive Driver-Assistance (Non-Safety) Subsystems
The 10M40DAF256C8G powers non-safety-critical ADAS subsystems such as surround-view camera aggregation and driver-display controllers because its 40K logic elements handle multiple CSI-2 / LVDS streams while the integrated ADC reads backup-camera analog inputs. Per Intel MAX 10 automotive collateral, this part supports AEC-Q100 Grade 2 (-40C to +105C) operation in the I7 temperature variant. The 256-FBGA package withstands automotive vibration profiles when assembled per IPC-9701 standards. Designers integrate CAN-FD and FlexRay interfaces via soft IP. For safety-critical ECUs (ASIL-C/D), migrate to Cyclone V or Arria V devices with hardware lockstep.
Recommended
Portable Test and Measurement Instrumentation
The 10M40DAF256C8G fits portable test-and-measurement instruments (oscilloscope front-ends, logic analyzers, bench DMMs) because its 40K logic elements implement custom DSP filtering and trigger logic while the 12-bit ADC samples analog front-end signals at up to 1 MSPS. The on-chip user flash stores calibration constants and instrument firmware per Intel MAX 10 datasheet. With 178 user I/O, designers expose USB, Ethernet, LCD, and keypad interfaces without external glue logic. The 256-FBGA's small 17 x 17 mm footprint enables handheld form factors. Compared to a microcontroller + DSP dual-chip solution, MAX 10 saves BOM cost and PCB area.
Recommended
Industrial Protocol Bridging and PLC I/O
The 10M40DAF256C8G bridges industrial protocols (EtherCAT, PROFINET, EtherNet/IP, Modbus TCP) because its 40K logic elements run soft-IP protocol stacks alongside deterministic glue logic, and its 178 user I/O accommodate isolated digital inputs and relay outputs typical of PLC backplanes. Per the Intel MAX 10 reference designs, the integrated ADC reads analog 4-20 mA current-loop sensors for process-control loops. The on-chip flash enables field firmware updates via the industrial network without external boot memory. The 256-FBGA footprint is well suited to compact DIN-rail-mounted I/O modules. Choose this part over a microcontroller when deterministic sub-microsecond response is required.
Recommended
Recommended Products Summary
Engineering reference data for 10M40DAF256C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M40DAF256C7G | 10M50DAF256C8G | 10M25DAF256C8G | 10M40DAF256A7G | 10M40DAF256I7G | 10M50DAF256C7G |
|---|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 256-FBGA (17x17 mm, 1.0 mm pitch) | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Logic Elements | 40,000 | 40,000 | 50,000 | 25,000 | 40,000 | 40,000 | 50,000 |
| Embedded Memory (bits) | 1,290,240 | 1,290,240 | 1,638,400 | 819,200 | 1,290,240 | 1,290,240 | 1,638,400 |
| Maximum User I/O | 178 | 178 | 178 | 178 | 178 | 178 | 178 |
| Speed Grade | C8 | C7 (faster) | C8 | C8 | A7 (automotive) | I7 (industrial temp) | C7 (faster) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +125C (automotive) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| ADC Blocks | Dual 12-bit sigma-delta | Dual 12-bit sigma-delta | Dual 12-bit sigma-delta | Dual 12-bit sigma-delta | Dual 12-bit sigma-delta | Dual 12-bit sigma-delta | Dual 12-bit sigma-delta |
| Unit Price (qty-1, USD) | $82.20 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- On-chip configuration flash eliminates external boot PROM (vs Cyclone V SRAM-based FPGAs)
- Integrated 12-bit ADC with up to 16 analog channels (vs Lattice ECP5 (no integrated ADC))
- 40K logic elements with 1.29 Mbit embedded SRAM (vs 10M25DAF256C8G)
- FBGA-256 with 1.0 mm pitch (vs FBGA-256 0.8 mm ultra-fine-pitch variants)
Design Notes
The 256-ball FBGA at 1.0 mm pitch requires microvia or laser-drilled via technology for inner-row fan-out; standard 0.3 mm mechanical drill vias cannot fit between balls. Per IPC-7093 design guidance for BGA packages, use 4-6 layer stackup with continuous ground planes beneath the BGA to control impedance for high-speed LVDS pairs. Apply solder mask defined (SMD) pads rather than non-solder mask defined (NSMD) for better ball-to-pad alignment on FineLine BGA.
Estimated: at typical motor-control utilization (60% LE, 80% toggle rate, 1.2 V core), the 10M40DAF256C8G dissipates approximately 1.0-1.5 W of dynamic power. With a junction-to-ambient thermal resistance of approximately 25 C/W (4-layer JEDEC JESD51 test board per FBGA-256 datasheet), the junction temperature rise is 25-38 C above ambient. For sealed industrial enclosures without forced airflow, add a thermal via array beneath the exposed die pad and 4-6 cm2 of top-side copper pour to keep Tj below 100 C at 70 C ambient.
Configuration pins MSEL[3:0] must be tied to VCCA or GND per the selected configuration mode (AS, PS, FPP, JTAG) - leaving them floating causes boot failure. The dual-configuration flash requires the CONF_DONE pin to be high before user mode is entered; add a 10 kohm pull-up to VCCIO bank 1B. For JTAG programming, route TMS, TDI, TDO, TCK with 4.7 kohm pull-ups on TMS and TDI to avoid noise-induced configuration corruption during in-system programming.
LVDS and DDR memory interfaces on MAX 10 require matched-length routing within 50 mils (1.27 mm) per Intel MAX 10 device family pin connection guidelines. Use 100 ohm differential impedance for LVDS pairs routed on a 4-layer PCB with the LVDS signals on the top layer over a continuous ground plane. The integrated ADC analog inputs must be guarded by a ground ring on the top layer and isolated from switching digital signals to avoid coupling noise; refer to the MAX 10 analog features datasheet section on ADC PCB layout.
Compliance Information
RoHS compliant per distributor listings. Standard 10M40DAF256C8G is not AEC-Q100 qualified - choose 10M40DAF256A7G or 10M40DAF256I7G for automotive/industrial temp grade. Lead-free FBGA solder ball finish per Intel MAX 10 material declaration.
