10M50DAF256C8G - MAX 10 FPGA 50K LE 256-FBGA | Intel
MPN: 10M50DAF256C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $72.5 | $72.50 |
| 10 | $65.2 | $652.00 |
| 100 | $58.1 | $5,810.00 |
| 500 | $52.4 | $26,200.00 |
| 1,000 | $47.85 | $47,850.00 |
10M50DAF256C8G Overview
MAX 10 FPGAs are low-cost, non-volatile PLDs that integrate the optimal set of system components typically found around an FPGA. They embed flash configuration memory, a hardened ADC block, dual-configuration flash, and instant-on support on a single die, eliminating the need for an external boot PROM. Architecturally, MAX 10 belongs to the programmable logic hierarchy (FPGA -> programmable logic device -> logic IC -> integrated circuit) and is positioned as a bridge between small CPLDs and higher-density Cyclone devices.
Key features include 50 K logic elements (LEs), 1,677 Kb (bits) of user flash, 312 18x18 multipliers, a 12-bit 1 MSPS ADC, on-chip temperature sensing, and integrated PLL blocks. The 256-FBGA (F256) package supports industrial temperature grades (the C8G speed/temperature code denotes commercial 8 ns timing) and exposes LVDS, LVTTL, and LVCMOS I/O standards. Internal configuration is achieved via embedded flash, giving instant-on behavior with no external boot device.
Typical applications include industrial I/O expansion and bridging, motor control and drive interfacing, video processing pipelines, low-cost prototyping for ASIC replacement, and I/O-aggregation in factory automation modules. The integrated ADC is well suited to sensor fusion and analog front-end monitoring on a single board, while the embedded flash enables remote firmware updates with no external memory.
When designing with the 10M50DAF256C8G, follow Intel PCB layout guidelines for the F256 package: route decoupling capacitors as close to each power pin pair as possible, provide a continuous ground plane beneath the BGA, and use at least 6 PCB layers with stitched ground vias for signal integrity. Designers should also plan thermal management; the F256 package has a moderate junction-to-ambient thermal resistance and may require airflow for high-utilization designs.
This page synthesizes distributor pricing (as of 2026-09-05), same-package drop-in alternatives within the MAX 10 family, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for 10M50DAF256C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10M50DAF256C8G (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Temperature Grade, PLLs.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M50DAF256I7G
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$155.2 / Unit
View Datasheet →10M50DAF256C7G
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
10M50DAF256I8G
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
10M50DCF256C8G
✅ Drop-In✓ In Stock
$52.85 / Unit
View Datasheet →10M50DCF256C7G
✅ Drop-In✓ In Stock
$98 / Unit
View Datasheet →10M40DAF256C8G
✅ Drop-In✓ In Stock
$55.2 / Unit
View Datasheet →10M25DAF256C8G
✅ Drop-In✓ In Stock
$45.3 / Unit
View Datasheet →10M50DAF256A7G
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
10M50DAF256C8G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements | 49,760 (50K) |
| Embedded Memory (bits) | 1,677,312 |
| User Flash (bits) | 1,677,312 |
| Maximum User I/Os | 178 |
| Multipliers (18x18) | 312 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| On-chip ADC | 12-bit, 1 MSPS, single or dual supply |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Configuration | Internal flash (non-volatile, instant-on) |
| Speed Grade | C8 (8 ns) |
| Temperature Grade | Commercial (0C to +85C) |
| Package | 256-ball FBGA (F256) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| MSL Level | 3 (per JEDEC J-STD-20) |
10M50DAF256C8G 256-ball fbga (f256) Pin Configuration Guide
Pin configuration for 10M50DAF256C8G (256-ball fbga (f256) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M50DAF256C8G.
Refer to the datasheet for full pin configuration.
Typical Applications
10M50DAF256C8G is suitable for 6 applications: Industrial I/O Expansion and Bridging, Multi-Axis Motor Control (FOC Servo Drives), Video Format Conversion and Processing, Low-Cost ASIC Replacement / Prototyping, Sensor Fusion and Data Acquisition Front-Ends, Industrial IoT Gateway and Edge Computing.
Industrial I/O Expansion and Bridging
The 10M50DAF256C8G provides 178 user I/Os and 50K LEs for protocol bridging between industrial fieldbus standards (EtherCAT, PROFINET, Modbus TCP, RS-485, CAN) and modern Ethernet-based controllers. Its non-volatile instant-on configuration eliminates external boot PROMs, and the embedded 12-bit ADC digitizes analog sensor inputs (4-20 mA, 0-10 V, thermocouples) without an external ADC IC. Designers place the FPGA between a processor's SPI/UART and the fieldbus transceivers, using hardware multipliers for fast CRC checksums and PLLs to synthesize precise baud rates. The 50K LE budget supports 8-16 simultaneous protocol stacks in firmware, sufficient for typical PLC expansion modules.
Recommended
Multi-Axis Motor Control (FOC Servo Drives)
The 10M50DAF256C8G drives up to 78 PID-based field-oriented-control (FOC) loops with 18-bit multipliers, supporting multi-axis servo drives under 10 kW per axis. Hardware PLLs synthesize precise 10-50 kHz PWM switching frequencies with sub-100ns resolution, while the on-chip 12-bit 1 MSPS ADC samples two phase currents plus DC-bus voltage per axis. The 50K LE budget lets engineers implement space-vector PWM, sine filtering, encoder decoding, and safety-watchdog logic in a single chip, replacing a DSP+ASIC combination. Intel publishes reference designs in AN 624 and AN 738 demonstrating MAX 10 in FOC motor control.
Recommended
Video Format Conversion and Processing
The 10M50DAF256C8G handles real-time video format conversion (RGB to LVDS, parallel-CMOS to MIPI bridge, VGA to HDMI preprocessing) with 178 I/Os supporting 24-bit parallel video buses plus control channels. Hardware multipliers enable pixel-level color correction, gamma, and chroma resampling in a single pass at 60 Hz 1080p. Embedded SRAM (1.67 Mb) acts as a multi-line frame buffer for deinterlacing and noise reduction. Compared to a discrete scaler IC, the FPGA gives flexibility to switch protocols via firmware, which is valuable in broadcast and pro-AV equipment where multiple input standards must be supported.
Recommended
Low-Cost ASIC Replacement / Prototyping
The 10M50DAF256C8G serves as a low-NRE ASIC replacement for production volumes under 50K units/year, especially in industrial and medical designs where ASIC mask charges exceed USD 500K. With 50K LEs, 1.67 Mb SRAM, embedded flash, and an on-chip ADC, designers can implement glue logic, state machines, custom peripherals, and analog front-ends in one device. Once volume justifies mask costs, the same Quartus Prime RTL can be re-targeted to a structured-ASIC or Cyclone family, preserving firmware investment.
Recommended
Sensor Fusion and Data Acquisition Front-Ends
The 10M50DAF256C8G combines an on-chip 12-bit 1 MSPS ADC, 178 I/Os, and 50K LEs to form a complete sensor-fusion front-end for industrial condition monitoring and multi-channel DAQ systems. Up to 16 analog channels can be time-multiplexed into the internal ADC while digital sensors stream via SPI/I2C. Hardware DSP blocks implement FFT-based vibration analysis, statistical filtering, and threshold detection. Embedded flash stores calibration coefficients and threshold tables, and instant-on behavior lets the system boot and report first readings within 50 ms of power-up.
Recommended
Industrial IoT Gateway and Edge Computing
The 10M50DAF256C8G operates as an edge-compute front-end for IIoT gateways: 50K LEs handle protocol parsing (MQTT, OPC-UA, CoAP), local decision logic, and pre-processing of sensor data before forwarding to a host CPU. Hardware multipliers accelerate AES-128 and SHA-256 for secure MQTT connections, while embedded flash stores credentials and configuration. With 178 I/Os the FPGA can interface directly to RS-485, RS-232, CAN, and SPI peripherals without external logic. Industrial -40C to +100C variants (10M50DAF256I7G) are drop-in compatible for harsh-environment deployments.
Recommended
Recommended Products Summary
Engineering reference data for 10M50DAF256C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M50DAF256I7G | 10M50DAF256C7G | 10M50DAF256I8G | 10M50DCF256C8G | 10M50DCF256C7G | 10M40DAF256C8G | 10M25DAF256C8G | 10M50DAF256A7G |
|---|---|---|---|---|---|---|---|---|---|
| Package | 256-ball FBGA (F256) | 256-ball FBGA (F256) | 256-ball FBGA (F256) | 256-ball FBGA (F256) | 256-ball FBGA (F256) | 256-ball FBGA (F256) | 256-ball FBGA (F256) | 256-ball FBGA (F256) | 256-ball FBGA (F256) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 49,760 | 49,760 | 49,760 | 49,760 | 49,760 | 49,760 | 39,600 (40K) | 24,640 (25K) | 49,760 |
| Embedded Memory (bits) | 1,677,312 | 1,677,312 | 1,677,312 | 1,677,312 | 1,259,520 | 823,296 | 1,677,312 | ||
| Speed Grade | C8 | I7 | C7 (faster) | I8 | C8 | C7 (faster) | C8 | C8 | A7 (automotive) |
| Temperature Grade | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Automotive -40C to +125C | ||||
| Supply Variant | Single-supply (A) | Single-supply (A) | Dual-supply (D) | Dual-supply (D) | Single-supply (A) | ||||
| Maximum User I/Os | 178 | 178 | 178 | 178 | 178 | 178 | 178 |
Key Differentiators
- Non-volatile configuration eliminates external boot PROM (vs 10M40DAF256C8G (also non-volatile))
- On-chip 12-bit ADC for analog front-end integration (vs 10M25DAF256C8G (also has ADC))
- Commercial C8 speed grade balances cost and performance (vs 10M50DAF256C7G (C7 speed grade))
- 178 user I/Os in compact F256 footprint (vs 10M50DAF484C8G (F484 package))
- Wide commercial-to-industrial drop-in family (vs Single-temperature competitor FPGAs)
Design Notes
Route all power pins of the F256 package through short, wide traces fed by 0.1 uF decoupling capacitors placed within 3 mm of each power-ball pair. Add bulk 10 uF-100 uF tantalum or ceramic capacitors adjacent to each power rail (1.2 V core, 2.5 V analog, I/O bank supplies). Use a continuous ground plane on the layer directly beneath the BGA to provide a low-impedance return path; stitch ground vias around and through the BGA escape pattern for signal integrity.
The F256 FBGA package has a theta_JA in the 25-30 C/W range with proper PCB layout (six-layer board with internal ground plane). Estimated: at 25% logic utilization with 312 active multipliers, the die dissipates approximately 0.7 W to 1.0 W, giving a junction temperature rise of 18-30 C above ambient. For high-utilization designs exceeding 60% LE and 75% multiplier occupancy, plan for forced-air cooling or a thermal-spreader PCB design. Always refer to the MAX 10 device thermal model AN for accurate simulation.
LVDS and high-speed DDR interfaces require matched-length routing with 100 ohm differential impedance. Keep BGA escape traces on the top layer for the first 5 mm, then transition to internal stripline layers. Series-termination resistors on LVCMOS outputs used above 100 MHz should be placed within 8 mm of the FPGA pin. The MAX 10 device handbook AN 692 provides IBIS models for Quartus Prime signal-integrity simulation.
Do not leave any MAX 10 power pin floating - even unused I/O bank supplies must be tied to a valid voltage for proper power-on-reset sequencing. The internal flash programming voltage (VCCIO7 for some banks) must be set to 1.8 V during configuration; mis-configuring it locks the device from JTAG access. Always run Quartus Prime pin-planner validation before generating the programming file, and use the 'Verify Pin-Out' check before downloading.
Place the JTAG header within 50 mm of the FPGA and route TDI, TDO, TMS, TCK as a length-matched group with 4.7 kΩ pull-ups on TCK/TMS and a 4.7 kΩ pull-up on TDI. Place a 4.7 kΩ pull-up on nCONFIG to ensure clean re-configuration after power-up. Reserve space for a status-LED connected to a CONFIG_DONE or USER_LED pin for visual bring-up diagnostics during board bring-up.
Compliance Information
RoHS and REACH compliance per DigiKey/Mouser product listings. AEC-Q100 qualification is NOT available on the 10M50DAF256C8G (commercial temperature only); choose 10M50DAF256A7G for AEC-Q automotive applications. Lead-free (Pb-free) finish confirmed. Halogen-free status not specified in the verified data.
